GB/T 13387-2009 English PDFUS$189.00 ยท In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 13387-2009: Test method for measuring flat length wafers of silicon and other electronic materials Status: Valid GB/T 13387: Historical versions
Basic dataStandard ID: GB/T 13387-2009 (GB/T13387-2009)Description (Translated English): Test method for measuring flat length wafers of silicon and other electronic materials Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: H80 Classification of International Standard: 29.045 Word Count Estimation: 8,887 Date of Issue: 2009-10-30 Date of Implementation: 2010-06-01 Older Standard (superseded by this standard): GB/T 13387-1992 Adopted Standard: SEMI MF 671-0705, MOD Regulation (derived from): National Standard Approval Announcement 2009 No.12 (Total No.152) Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This standard specifies the length of the straight part of the wafer edge is recognized methods. This standard for the nominal length of the straight part of the circular edge of the wafer electrical material 65mm or less. This standard is only to confirm the accuracy of silicon, the accuracy is not expected to change because of the material. GB/T 13387-2009: Test method for measuring flat length wafers of silicon and other electronic materials---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Test method for measuring flat length wafers of silicon and other electronic materials ICS 29.045 H80 National Standards of People's Republic of China Replacing GB/T 13387-1992 Silicon wafers and other electronic materials Methods for measuring flat length Posted 2009-10-30 2010-06-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released ForewordThis revised standard adopts SEMIMF671-0705 "silicon wafer reference surface and the length of the test method other electronic materials." The standards are compared with SEMIMF671-0705 major changes as follows. --- Standard format prepared according to GB/T 1.1 requirements to prepare; --- Increased foreword content. This standard replaces GB/T 13387-1992 "Electronic Materials wafer reference surface length of the test method." The standards are compared with the GB/T 13387-1992 main changes as follows. --- Detailed the contents of the measuring range, as the process involved in metric units; --- Increase the limitations of this method; --- An increase of some terms and definitions used in measuring the offset; --- Increasing the reference standard; --- Original standard sample to sample chapters; --- The calibration and measurement is divided into two chapters are described separately; --- Evaluation SEMIMF671-0705 precision using multiple laboratories, together with a more detailed explanation. This standard by the National Standardization Technical Committee of semiconductor equipment and materials proposed. This standard by the National Standardization Technical Committee materials and equipment at the Technical Committee of semiconductor material. This standard was drafted. Grinm Semiconductor Materials Co., Ltd. The main drafters of this standard. Du, Sun Yan, Lu Liyan. This standard replaces the standards previously issued as follows. --- GB/T 13387-1992. Silicon wafers and other electronic materials Methods for measuring flat length Objective 1 1.1 datum length for the materials used in semiconductor processing adaptability is an important parameter. 1.2 automated wafer handling equipment is widely used in semiconductor manufacturing, they are getting the right by the main wafer reference plane to identify and locate Alignment.2 range2.1 standard covers the flat portion of the wafer edge length confirmation method. 2.2 standard for nominal circular wafer edge straight section length is less than equal to 65mm electrical material. This standard only silicon accuracy Confirmation, the accuracy is not expected due to material change. 2.3 measurement standard applies to arbitration, when the limit is higher than the accuracy requirements with a ruler and a visual inspection can be obtained by the present standards For routine inspection measurements. 2.4 standard has nothing to do with the surface finish. 2.5 The diameter of the wafer, including 76.2mm and smaller diameter wafers, flat length units should use the metric units of measurement, The value imperial units are for reference only. 2.6 standard does not address safety issues, if any, associated with the use of standards. Standard before use, to establish appropriate safety and security measures Shi and determine the scope of application of rules and regulations is the responsibility of the user of this standard.3 LimitationsSome processes such as chamfer 3.1 after slicing and chemical corrosion are likely to reduce the clarity of the reference surface area of \u200b\u200bthe edge portion. Rotation of the screw measuring 3.2 micrometer backwards may cause erroneous readings. Samples measuring 3.3 on the projector screen during the unfocused images may introduce errors. 3.4 projector optical system may sometimes there is an image inversion function, resulting in the image presented in this standard the opposite state.4 Normative ReferencesThe following documents contain provisions which, through reference in this standard and become the standard terms. For dated references, subsequent Amendments (not including errata content) or revisions do not apply to this standard, however, encourage the parties to the agreement are based on research Whether the latest versions of these documents. For undated reference documents, the latest versions apply to this standard. GB/T 2828.1 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch inspection sampling plan GB/T 14264 semiconductor material terms5 termsGB/T 14264 and the following definitions of terms apply to this standard. 5.1 Wafer edge region of the reference surface from the horizontal to the vertical reference line deviation on either side of the edge region of the reference surface, used to define the reference plane Border. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 13387-2009_English be delivered?Answer: Upon your order, we will start to translate GB/T 13387-2009_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 13387-2009_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 13387-2009_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countriesQuestion 4: Do you accept my currency other than USD?Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.Question 5: Should I purchase the latest version GB/T 13387-2009?Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 13387-2009 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically. |
