GB/T 5230-2020 English PDF

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GB/T 5230-2020: Electrodeposited copper foil for printed board
Status: Valid

GB/T 5230: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 5230-2020	389	Add to Cart	4 days	Electrodeposited copper foil for printed board	Valid
GB/T 5230-1995	519	Add to Cart	3 days	Electrodeposited copper foil	Obsolete
GB 5230-1985	519	Add to Cart	4 days	Electrodeposited copper foil	Obsolete

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Basic data

Standard ID: GB/T 5230-2020 (GB/T5230-2020)
Description (Translated English): Electrodeposited copper foil for printed board
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H62
Classification of International Standard: 77.150.30
Word Count Estimation: 21,241
Date of Issue: 2020-09-29
Date of Implementation: 2021-08-01
Older Standard (superseded by this standard): GB/T 5230-1995
Regulation (derived from): National Standard Announcement No. 20 of 2020
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 5230-2020: Electrodeposited copper foil for printed board

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Electrodeposited copper foil for printed board ICS 77.150.30 H62 National Standards of People's Republic of China Replace GB/T 5230-1995 Electrolytic copper foil for printed boards 2020-09-29 released 2021-08-01 implementation State Administration for Market Regulation Issued by the National Standardization Management Committee

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 5230-1995 "Electrolytic Copper Foil". Compared with GB/T 5230-1995, the main technical changes of this standard are as follows. ---Added the terms and definitions of "elongation", "profile", "smooth surface" and "rough surface" (see Chapter 3). ---The model number has been increased from 2 to 5 (see 4.1, Table 1 of the.1995 edition). ---Added the copper foil code and mark (see 4.2, 4.3). ---Modified the length and width deviation of the sheet-shaped copper foil, from "the agreement between the supplier and the demander" to "the allowable length deviation is L 4.00 0 mm The allowable width deviation is W 2.00 0 mm or agreed by the supplier and the buyer" (see 5.2.1, 5.2.2.2 of the.1995 edition). ---Modified the width deviation of the packaged copper foil, from the 4 width range section regulations to "the width allowable deviation is W 2.0 0 mm Or it can be negotiated between the supplier and the buyer" (see 5.2.2, Table 3 in the.1995 edition). ---Increase the specifications of unit area mass and thickness, from 11 types to 16 types, increase the allowable deviation of unit area mass "high" "Accuracy" grade (see Table 3, Table 2 of the.1995 edition). ---Added the copper foil profile type and profile requirements (see Table 4). --- Modify the surface roughness requirements of copper foil (see 5.2.6, 5.7.3 of the.1995 edition). --- Modify the physical properties of copper foil (see Table 5, 5.3 of the.1995 edition). ● E-01 foil. increase the tensile strength and elongation index of the thickness of 9μm and 12μm foil; compared to the original standard, increase the thickness The tensile strength and elongation index of 18μm, 35μm, 70μm foil; the specific performance index of thickness 25μm foil is deleted, Amended as "to be agreed between the supplier and the buyer." ● E-02 foil. Increase the tensile strength and elongation index of the thickness of 12μm foil; compared with the original standard, it has increased by 18μm, 35μm, The tensile strength index of 70μm foil. ● Increase the tensile strength and elongation index of E-03, E-04, E-05 foil and the fatigue ductility index of E-05 foil. ---Added "etchability", "chemical cleaning", "processing transfer", "high temperature oxidation resistance" and "purity" requirements (see 5.4.1, 5.4.2, 5.4.4, 5.4.5, 5.5). ---Added 15μm copper foil mass resistivity regulations (see Table 6). ---Chapter 7 (Inspection Rules) has been revised, adding inspection classification, test conditions, identification inspection and quality consistency inspection items, sampling and Judgment (see Chapter 7). ---Appendix A (informative appendix) "Comparison of Electrolytic Copper Foil Models at Home and Abroad" has been added (see Appendix A). ---Added Appendix B (Appendix to the specification) "Test Method for Copper Powder Diameter and Quantity" (see Appendix B). ---Appendix C (normative appendix) "Testing Method for Copper Foil Warpage" has been added (see Appendix C). --- The 7 appendices of GB/T 5230-1995 have been deleted (see Appendix A, Appendix B, Appendix C, Appendix D, Appendix E, Appendix F, Appendix G). This standard was proposed by China Nonferrous Metals Industry Association. This standard is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243). Drafting organizations of this standard. Anhui Tongguan Copper Foil Co., Ltd., Xianyang Ruide Technology Co., Ltd., Guangdong Jiayuan Technology Co., Ltd., Qinghai Electronic Materials Industry Development Co., Ltd., Shandong Jinbao Electronics Co., Ltd., Fogang Kingboard Industrial Co., Ltd., Hefei Tongguan Guoxuan Copper Materials Co., Ltd. The main drafters of this standard. Lu Binghu, Gao Yanru, Li Yongzhen, Wang Junfeng, Liu Xueping, Li Wenjian, Wang Airong, Li Dashuang, Wu Bin. The previous versions of the standard replaced by this standard are as follows. ---GB/T 5230-1985, GB/T 5230-1995. Electrolytic copper foil for printed boards

1 Scope

This standard specifies the classification, code and marking, technical requirements, test methods, inspection rules and signs, packaging, Transport, storage, quality certificate and purchase order (or contract) content. This standard applies to electrolytic copper foil for printed boards (hereinafter referred to as "copper foil").

2 Normative references

The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 2036 Terminology for Printed Circuits GB/T 8888 Packaging, marking, transportation, storage and quality certificate of heavy non-ferrous metal processing products GB/T 29847-2013 Test method of copper foil for printed boards

3 Terms and definitions

The following terms and definitions defined in GB/T 2036 apply to this document. 3.1 Elongation When the sample breaks under tensile load, the percentage of the ratio of the incremental distance between the marking lines of the effective part of the sample and the distance between the initial marking lines. [GB/T 31471-2015, definition 3.1] 3.2 Foilprofile The unevenness of the surface of the copper foil caused by processing and (or) enhanced bonding treatment. [GB/T 31471-2015, definition 3.4] 3.3 Arithmeticalmeandeviationoftheprofile Ra Within the measured length, the arithmetic average of all absolute distances from the center line to the rough profile. [GB/T 31471-2015, definition 3.5] 3.4 10 point height of microscopic unevenness tenpointheightofirregularitties Rz Within the sampling length, the sum of the average of the 5 largest profile peak heights and the 5 largest profile valley depths. 3.5 Smoothside The cathode surface is the surface of the electrolytic copper foil close to the cathode roller. [GB/T 31471-2015, definition 3.7] ......

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