GB/T 42158-2023 English PDFUS$474.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 42158-2023: Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures Status: Valid
Basic dataStandard ID: GB/T 42158-2023 (GB/T42158-2023)Description (Translated English): Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L59 Classification of International Standard: 31.080.99 Word Count Estimation: 26,237 Date of Issue: 2023-03-17 Date of Implementation: 2023-07-01 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 42158-2023: Micro-electromechanical systems technology(MEMS) - Description and measurement methods for micro trench and pyramidal needle structures---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. ICS31:080:99 CCSL59 National Standards of People's Republic of China GB/T 42158-2023/IEC 62047-26:2016 microelectromechanical systems (MEMS) technology microgrooves and Description and Measurement of Pyramidal Needle Structure structures, IDT) Released on 2023-03-17 2023-07-01 implementation State Administration for Market Regulation Released by the National Standardization Management Committee table of contentsPreface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Description of Microscale Trench Structure 1 4:1 Overview 1 4:2 Symbols and names 2 4:3 Description 3 5 Description of Micrometer-Scale Pyramidal Needle Structures3 5:1 Overview 3 5:2 Symbols and names 4 5:3 Description 5 6 Measurement method 5 Appendix A (Informative) Measurement Examples of Microscale Grooves and Pyramidal Needle Structures 6 Appendix B (informative) Dimensional measurement uncertainty 18 Reference 20forewordThis document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents" drafting: This document is equivalent to IEC 62047-26:2016 "Micro-electromechanical devices for semiconductor devices - Part 26: Description of micro-trench and needle structures Description and Measurement Methods": The following minimal editorial changes have been made to this document: --- In order to further clarify the scope of application of the standard, the "needle structure" is changed to "pyramidal needle structure": In order to coordinate with the existing standards, the standard The quasi-name was changed to "Description and Measurement Methods of Micro-Groove and Pyramidal Needle Structures in Micro-Electro-Mechanical Systems (MEMS) Technology"; --- Corrected the error in the original text of IEC 62047-26:2016: In order to clearly show the cross-section of the sample, the "as in 4:2 in A:2:1:2 "As shown in Table 1" is changed to "as shown in Figure 1", and Table 1 of 4:2 does not give a cross-sectional view of the sample: Please note that some contents of this document may refer to patents: The issuing agency of this document assumes no responsibility for identifying patents: This document is proposed and managed by the National Micro-Electro-Mechanical Technology Standardization Technical Committee (SAC/TC336): This document was drafted by: Suzhou Institute of Quality and Standardization, China Machine Productivity Promotion Center Co:, Ltd:, Suzhou Lanxin Micro-Nano Technology Co:, Ltd: Company, Southeast University, Suzhou Standardization Association, Meimoxinsheng (Hangzhou) Microelectronics Co:, Ltd:, Shenzhen Zhongtu Instrument Co:, Ltd:, Sichuan Fusheng Electric Co:, Ltd:, Shenzhen Meisi Advanced Electronics Co:, Ltd:, China National Accreditation Center for Conformity Assessment, Shenzhen Daoge Special Technology Co:, Ltd: The main drafters of this document: Zhang Shuo, Gu Feng, Li Genzi, Shen Junjie, Yu Xiao, Zhou Zaifa, Wang Minrui, Jia Jianguo, Xu Baihong, Xu Keyu, Wang Zhiyuan, Liu Zhiguang: microelectromechanical systems (MEMS) technology microgrooves and Description and Measurement of Pyramidal Needle Structure1 ScopeThis document describes a microscale trench structure and a pyramidal needle structure and gives examples of measurements of the geometries of both structures: this document The depth of the middle groove structure is 1 μm-100 μm, the groove width and the groove interval width are both 5 μm-150 μm, and the aspect ratio is 0:0067-20: Pyramid needle structure has three or four faces, its height, lateral width and longitudinal width are 2 μm or more, and the outer contour size can include Contained in a cube of side length 100 μm: This document is applicable to the design of MEMS structures and the evaluation of the geometries after fabrication of MEMS structures:2 Normative referencesThis document has no normative references:3 Terms and DefinitionsThe following terms and definitions apply to this document: 3:1 Trench structure trenchstructure Etching on the substrate forms one or more structures whose upper surface is rectangular and whose cross-section is consistent (identical) trapezoidal: 3:2 A pointed convex structure consisting of at least three faces on a planar base, the convex structure being on a vertical face of the planar base have a plane of symmetry: 3:3 trench array walandtrench A structure in which two or more trench structures are arranged in parallel at regular intervals: 3:4 corrugated structure scalop In the deep reactive ion etching (DRIE) process of silicon, polymer passivation protection and bottom selective etching in the trench are repeated multiple times: The irregular periodic undulating structure of the side wall formed by etching:4 Description of Microscale Trench Structure4:1 Overview This document presents a method for characterizing the cross-sectional geometry of microscale trench structures: Figure 1 shows the cross-sectional view required for characterization: trench junction The geometric shape of the cross-section of the structure is the cross-sectional shape at the straight line vertically intersecting the groove structure when viewed from the upper surface of the substrate, and the error is ±1° or smaller: ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 42158-2023_English be delivered?Answer: Upon your order, we will start to translate GB/T 42158-2023_English as soon as possible, and keep you informed of the progress. The lead time is typically 2 ~ 4 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 42158-2023_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 42158-2023_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countriesQuestion 4: Do you accept my currency other than USD?Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay. |
