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GB/T 38341-2019 English PDF

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GB/T 38341-2019: Micro-electromechanical system technology - The reliability test methods of MEMS in integrated environments
Status: Valid
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GB/T 38341-2019379 Add to Cart 4 days Micro-electromechanical system technology - The reliability test methods of MEMS in integrated environments Valid

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Basic data

Standard ID: GB/T 38341-2019 (GB/T38341-2019)
Description (Translated English): Micro-electromechanical system technology - The reliability test methods of MEMS in integrated environments
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L55
Classification of International Standard: 31.200
Word Count Estimation: 19,157
Date of Issue: 2019-12-31
Date of Implementation: 2020-04-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 38341-2019: Micro-electromechanical system technology - The reliability test methods of MEMS in integrated environments


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Micro-electromechanical system technology-The reliability test methods of MEMS in integrated environments ICS 31.200 L55 National Standards of People's Republic of China Microelectromechanical systems (MEMS) technology Comprehensive environmental test method for reliability of MEMS devices 2019-12-31 release 2020-04-01 implementation State Administration of Market Supervision Published by the National Standardization Administration

Contents

Foreword III 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 Test method 1 4.1 Pretreatment 1 4.2 Temperature and humidity test 2 4.3 Mechanical test 9 4.4 Coupling test 12 5 Failure result processing 15 Reference 16

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard was proposed and managed by the National Micro-Electro-Mechanical Technology Standardization Technical Committee (SAC/TC336). This standard was drafted. Southeast University, Huawei Technologies Co., Ltd., Foshan Chuandong Magnetic Power Co., Ltd., China Machine Productivity Promotion Center Xin, Zhejiang Boya Precision Machinery Co., Ltd., Shenyang Guoyi Testing Technology Co., Ltd., Wuxi China Resources Shanghua Technology Co., Ltd., Peking University, North University of China, Institute of Electronics, Chinese Academy of Sciences, Beijing Bichuang Technology Co., Ltd. The main drafters of this standard. Wang Lei, Huang Chuangjun, Yu Zhenyi, Lu Xuegui, Zhu Yue, Xia Changfeng, Huang Qing'an, Long Kewen, Shi Yunbo, Li Haibin, Xiao Kunhui, Zheng Fengjie, Zhang Wei, Cheng Yixuan, Ma Shuzheng, Chen Demin. Microelectromechanical systems (MEMS) technology Comprehensive environmental test method for reliability of MEMS devices

1 Scope

This standard specifies the test method and failure result treatment for the comprehensive environment of MEMS device reliability. This standard applies to MEMS devices that require reliability testing.

2 Normative references

The following documents are essential for the application of this document. For dated references, only the dated version applies to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 26111 Micro-Electro-Mechanical System (MEMS) technical terms

3 terms and definitions

The terms and definitions defined in GB/T 26111 apply to this document.

4 Test method

4.1 pre-processing 4.1.1 Overview The device should be pre-treated before the test. If the device does not require soldering during use or the user believes that soldering will not affect the device Response, no preprocessing is required. 4.1.2 Purpose This test simulates the effects of various environments experienced by the device during welding due to welding. Due to temperature and humidity during the welding process The degree of influence may cause thermal mismatch stress, large strain caused by water vapor evaporation, and failure of organic pollution. So there is welding The required devices shall be subjected to this test. 4.1.3 Equipment The test equipment includes a temperature-controlled test chamber that can be thermostated at a specified temperature, and a soaking device that can work at a specified temperature and humidity Equipment, and a reflow equipment capable of reaching the specified temperature. 4.1.4 Procedure 4.1.4.1 Maintenance and initial treatment of the test chamber Prior to the start of the test timing, the temperature test box should retain sufficient heating time to ensure that the temperature of all samples to be measured is as uniform as possible; The equipment shall retain sufficient temperature and humidity control time, and all the devices under test shall reach the specified temperature and humidity.
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