GB/T 34954.1-2017 English PDF

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GB/T 34954.1-2017: Process management for avionics -- Electronic components capability in operation -- Part 1: Temperature uprating
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Basic data

Standard ID: GB/T 34954.1-2017 (GB/T34954.1-2017)
Description (Translated English): Process management for avionics -- Electronic components capability in operation -- Part 1: Temperature uprating
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: V04
Classification of International Standard: 49.020
Word Count Estimation: 46,434
Date of Issue: 2017-11-01
Date of Implementation: 2018-05-01
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 34954.1-2017: Process management for avionics -- Electronic components capability in operation -- Part 1: Temperature uprating

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Process management for avionics-Electronic components capability in operation-Part 1. Temperature uprating ICS 49.020 V04 National Standards of People's Republic of China Avionics process management electronics performance Part 1. Temperature rise operation-Part 1.Temperatureuprating (IEC /T R62240-1.2013, IDT) Posted.2017-11-01 2018-05-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released Directory Foreword Ⅲ Introduction IV 1 Scope 1 2 Normative references 1 3 Terms, definitions and abbreviations 1 3.1 Terms and definitions 1 3.2 Abbreviations 3 4 selection rules 3 4.1 General 3 4.2 Device Selection, Use and Replacement 4 4.2.1 General 4 4.2.2 Select 4 4.2.3 Device Technology 4 4.2.4 Follow the Electronic Device Management Plan 4 4.3 Device Performance Evaluation 5 4.3.1 General 5 4.3.2 device package and internal structure performance evaluation 5 4.3.3 Risk Assessment (Assembly Level) 5 4.3.4 Device Raise Method 5 4.3.5 device reliability assurance 7 4.4 Device Warranty over a Wide Temperature Range 7 4.4.1 General 7 4.4.2 Device Parameter Revaluation Test 7 4.4.3 Device Parameter Conformance Test 7 4.4.4 Higher Assembly Level Testing 7 4.4.5 Semiconductor Device Change Monitoring 8 4.4.6 Failure Data Collection and Analysis 8 4.5 Form document 8 4.6 Device Identification 8 Appendix A (Informative) Device Parameter Reevaluation 11 Appendix B (Informative) Stress Balancing 22 Appendix C (informative) parameter consistency assessment 31 Appendix D (Informative) Higher Assembly Level Tests References 40

Foreword

GB/T 34954 "avionics process management electronic device performance" is divided into several parts. The current plan to release the following section. --- Part 1. Temperature rise. The rest of the IEC 62240 "avionics process management electronics performance" has not been released, this standard will follow up follow-up IEC 62240 series of standards for the release and improve the situation. This section GB/T 34954 Part 1. This section drafted in accordance with GB/T 1.1-2009 given rules. This section uses the translation method identical with IEC /T R62240-1.2013 "avionics process management electronic device performance Part 1. Temperature rise ". This part is proposed by China Aviation Industry Corporation. This part of the National Avionics Process Management Standardization Technical Committee (SAC/TC427) centralized. This part of the drafting unit. China Aviation Institute of integrated technology, AVIC Xi'an Institute of Aeronautical Computing Technology. The main drafters of this section. Lu Xiaoqing, Liang Yuan, Yang Yang, Li Peng, Meng Yuci, Liu Wenyuan, Road Haotian.

Introduction

Anti-harassment of electronic products Traditional manufacturing relies on the implementation of military standards for semiconductor devices, produced by the military standard semiconductor plant Provide sources of supply, it can be used to ensure that the operating temperature range of semiconductor devices cover the actual application temperature range. In recent years, the country Many manufacturers outside of the military have left the military market, making available a wide range of devices to reduce the wide temperature range. Typical device temperature range used in the market Wai is. --- Military grade. -55 ℃ ~ 125 ℃; --- Automotive grade.-40 ℃ ~ 125 ℃; --- Industrial grade.-40 ℃ ~ 85 ℃; --- Commercial grade .0 ℃ ~ 70 ℃. In the absence of an alternative device, the potential result is that the device manufacturer will use the device beyond the device manufacturer's given product manual Specified temperature range. This section gives methods and guidelines for device selection, performance evaluation and quality assurance over a wider temperature range, The required documentation requirements for using the device within a range of degrees. This section may be implemented through consultation with the original device manufacturer. Using the device outside the manufacturer's specified temperature range may result in failure to obtain the quality assurance provided by the device manufacturer. Avionics process management electronics performance Part 1. Temperature rise

1 Scope

GB/T 34954 provisions of this part of the manufacturer exceeds the specified temperature range semiconductor device requirements. Used in the device In the event that no suitable alternative device is available, raise the device in accordance with the provisions of this section, otherwise the device shall be provided in the device manual Use under the piece. The term "lift" is increasingly being used in the avionics industry discussions and conferences, as defined in Chapter 3 for a definitive definition. The rise is the device selection Special method for circuit design. This section provides methods and processes for device upgrade. All methods and procedures in this section are based on the current, engineering application of the best method. General requirements If no more stringent requirements, should be strictly in the process of using this process. Prerequisites for using the device over a wider temperature range, especially for very small-size devices (eg, ≤90nm feature size) are Does not affect the performance parameters and reliability of its use. This section does not allow the device to exceed the absolute maximum specified by the original device manufacturer Use the device beyond the set value. This section also provides. --- Only when no other suitable alternative device is available, the device can be used outside the original device manufacturer's specified temperature range, should be replaced Do verification --- If you need to use the device outside the original device manufacturer's specified temperature range, you should form a log file and control flow to protect Card equipment integrity.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. IEC /T S62239-1 process management of avionics management plan Part 1. Preparation of electronic components management plan and Maintenance (Process managementforavionics-Managementplan-Part 1.Preparationandmaintenanceofan electroniccomponentsmanagementplan) 3 Terms, definitions and abbreviations 3.1 Terms and definitions The following terms and definitions apply to this document. 3.1.1 Absolute maximumimum rating absolute The limits for the operational and environmental conditions of the device as specified in the published device datasheet shall not exceed Range of use of the device. 3.1.2 Ambient temperature ambienttemperature Semiconductor device working environment temperature. ......

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