GB/T 34507-2017 English PDF

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GB/T 34507-2017: Palladium coated copper bonding wire for semiconductor package
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 34507-2017	359	Add to Cart	4 days	Palladium coated copper bonding wire for semiconductor package	Valid

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Basic data

Standard ID: GB/T 34507-2017 (GB/T34507-2017)
Description (Translated English): Palladium coated copper bonding wire for semiconductor package
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H68
Classification of International Standard: 77.150.99
Word Count Estimation: 18,156
Date of Issue: 2017-10-14
Date of Implementation: 2018-05-01
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 34507-2017: Palladium coated copper bonding wire for semiconductor package

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Palladium coated copper bonding wire for semiconductor package ICS 77.150.99 H68 National Standards of People's Republic of China Package bonding with palladium-plated copper wire 2017-10-14 Published 2018-05-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard is proposed by China Nonferrous Metals Industry Association. This standard by the National Non-ferrous Metal Standardization Technical Committee (SAC/TC243) centralized. This standard drafting unit. Beijing Dubbo non-ferrous metal solder limited liability company, Shandong Branch Ding new Electronic Technology Co., Ltd., non-ferrous metals Technology and Economy Institute, Zhejiang Jia Bo Technology Co., Ltd., Guangdong Jia Bo Electronic Technology Co., Ltd. The main drafters of this standard. Yan Ru, Tsui Wah, Xiang Lei, Li Tianxiang, Zhao Yidong, Zhou Gang, Zhou Xiaoguang, Liu Jie, Gao Liang, Liang Zhong, Sun Ni. Package bonding with palladium-plated copper wire

1 Scope

This standard specifies the semiconductor package, including discrete devices, integrated circuits, LED package with palladium-plated copper requirements, test methods, testing Rules, marking, packaging, transportation, storage, quality certificates, purchase orders (or contracts). This standard applies to the semiconductor package with palladium-plated copper wire.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 5121.27 Methods for chemical analysis of copper and copper alloys Part 27. Inductively coupled plasma atomic emission spectrometry GB/T 10573 non-ferrous metal filament tensile test method YS/T 716.7 Black copper chemical analysis method - Part 7. Determination of platinum content and palladium content Fire test gold enrichment - Inductively coupled plasma Atomic Emission Spectrometry and Flame Atomic Absorption Spectrometry

3 requirements

3.1 product classification Product model, status, diameter should be consistent with the provisions of Table 1. Table 1 Model Status Diameter/mm HCP1-n semi-hard state 0.013, 0.015, 0.016, 0.017, 0.018, 0.019.0.020, 0.021, 0.022, 0.023, 0.025, 0.028, 0.030, 0.032, 0.033, 0.035, 0.038, 0.040, 0.042, 0.043, 0.044, 0.045, 0.050 Note 1. Other diameter products can be produced upon request. Note 2. The manufacturer can be based on different chemical composition of the model assigned. 3.2 Product Marking Examples HCP Copper-plated copper wire (H-Highpurity; C-Copper; P-Paladium) □, Model (1-n) φ □ diameter × □ m length Diameter is marked in millimeters. ......

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