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GB/T 31476-2015 English PDF

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US$379.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 31476-2015: Requirements for solders for high-quality interconnections in electronics assembly
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 31476-2015	379	Add to Cart	3 days	Requirements for solders for high-quality interconnections in electronics assembly	Valid

Similar standards

GB/T 37201 GB/T 34482 GB/T 34190 GB/T 31475 GB/T 31474

Basic data

Standard ID: GB/T 31476-2015 (GB/T31476-2015)
Description (Translated English): Requirements for solders for high-quality interconnections in electronics assembly
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H21
Classification of International Standard: 29.045
Word Count Estimation: 18,124
Date of Issue: 2015-05-15
Date of Implementation: 2016-01-01
Quoted Standard: GB/T 3260.1; GB/T 3260.2; GB/T 3260.3; GB/T 3260.4; GB/T 3260.5; GB/T 3260.6; GB/T 3260.7; GB/T 3260.8; GB/T 3260.9; GB/T 3260.10; GB/T 10574.1; GB/T 10574.2; GB/T 10574.3; GB/T 10574.4; GB/T 10574.5; GB/T 10574.6; GB/T 10574.7; GB/T 10574.8; GB/T 10574.9; GB/T 10574.10; GB/T 10574.11; GB/T 10574.12; GB/T 10574.13; GB/T 31474; GB/T 31475; SJ/T 11390; YS/T 746.1; YS/T 746.2; YS/T 746.3; YS/T 746.4; YS/T 746.5; YS/T 746.6; YS/T 746.7; YS/T 746.8; YS/T 746.9; YS/T 746.10; YS/T 746.11; YS/T 746.12; YS/T 746.13; YS/T 746.14; YS/T 746.15; YS/T 746.16; ISO 9453
Regulation (derived from): National Standard Announcement 2015 No. 15
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This Standard specifies the electronic assembly interconnect solder quality classification, technical requirements, test methods, inspection rules and product labeling, packaging, transportation and storage. This Standard applies to electronic product assembly and brazing solder connection, including leaded solder, lead-free solder and special solder.

GB/T 31476-2015: Requirements for solders for high-quality interconnections in electronics assembly

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Requirements for solders for high-quality interconnections in electronics assembly ICS 29.045 H21 National Standards of People's Republic of China Electronics assembly quality interconnect with solder Issued on. 2015-05-15 2016-01-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Preface Ⅰ 1 Scope 1 2 Normative references 1 3 Terms and definitions 4 classification and marking 2 5 2 Technical Requirements 6 Test methods 8 7 Inspection rules 9 8 signs, packaging, transportation and storage 10 9 11 Quality Certificate Appendix A (informative) electronic solder melting temperature of 12

Foreword

This standard and GB/T 31474-2015 "electronic assembly interconnect with high flux" and GB/T 31475-2015 "electronic device Associated with high quality interconnect solder paste "a complete electronic welding material standard series. This standard was drafted in accordance with GB/T 1.1-2009 given rules. Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents. The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard by the National Standardization Technical Committee of the printed circuit (SAC/TC47) centralized. This standard was drafted. Chongqing University of Technology, Ministry of Information Industry materials for Quality Supervision and Inspection Center, China Electronics Standardization Institute Study hospital, Guangdong Anson tin products Manufacturing Co., Ltd., Yunnan Tin Co., Shenzhen special dual CD-Chemical Development Co., Ltd., sure love France Metal Co., Ltd., Zhejiang strong solder materials Co., Ltd., Zhejiang, a far Electronic Technology Co., Ltd., Dongguan City Kuril metal tin Commodities Limited Division, Electronic Guang Xi Tai Welding Material Co., Ltd. Hong Tin Co., Ltd. Hunan Chenzhou. Drafters of this standard. Du Changhua, He Xiukun, Xian display, right Liu, Zhang Hui, Litian Min, Ruan Jinquan, Tuqiang Zhao, Yuhong Gui, Huang Shouyou, Wuyong Tian, \u200b\u200bJiang Jinguang. Electronics assembly quality interconnect with solder

1 Scope

This standard specifies the standard electronic assembly interconnect with solder quality classification, technical requirements, test methods, inspection rules and product Chi, packaging, transportation, storage. This standard applies to electronic products assembly soldered with solder, including leaded solder, lead-free solders and special solders.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 3260 (all parts), chemical analysis of tin GB/T 10574 (all parts), chemical analysis of tin Method GB/T 31474 electronics assembly quality interconnect Flux GB/T 31475 quality electronic assembly interconnect with solder paste SJ/T 11390 Test method for lead-free solder YS/T 746 (all parts) lead-free tin-based solders chemical analysis ISO 9453 soft solder alloy chemical composition and morphology (Softsolderaloys-Chemicalcompositionsand forms)

3 Terms and Definitions

The following terms and definitions apply to this document. 3.1 Alloy aloy Combination of two or more elements made of a material with metallic properties. 3.2 Solder solder Melting point used for brazing alloy 450 ℃ lower than the connection, also known soft solder. 3.3 Leaded solder containingPbsolder Lead content greater than 0.10% (by mass) of the solder. 3.4 Lead-free solder Pb-freesolder Lead content of not more than 0.10% (by mass) of the solder. 3.5 Flux flux In the brazing process can help promote solder flow and interfacial reaction of chemicals used. ......

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Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 31476-2015_English be delivered?

Answer: Upon your order, we will start to translate GB/T 31476-2015_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 31476-2015_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 31476-2015_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.