GB/T 31475-2015 English PDFUS$379.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 31475-2015: Requirements for solder paste for high-quality interconnections in electronics assembly Status: Valid
Basic dataStandard ID: GB/T 31475-2015 (GB/T31475-2015)Description (Translated English): Requirements for solder paste for high-quality interconnections in electronics assembly Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: H21 Classification of International Standard: 29.045 Word Count Estimation: 18,132 Date of Issue: 2015-05-15 Date of Implementation: 2016-01-01 Quoted Standard: GB/T 2040; GB/T 2828.1; GB/T 10574; GB/T 31476; GB/T 31474; YS/T 746 Regulation (derived from): National Standard Announcement 2015 No. 15 Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This standard specifies the electronics assembly quality interconnect with solder paste (solder paste for short) classification, technical requirements, test methods, inspection rules and product labeling, packaging, transportation and storage. This standard applies soldering paste used in the surface mount components and electronic circuit interconnects. GB/T 31475-2015: Requirements for solder paste for high-quality interconnections in electronics assembly---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Requirements for solder paste for high-quality interconnections in electronics assembly ICS 29.045 H21 National Standards of People's Republic of China High quality solder paste for electronic assembly Published on May 15,.2015 2016-01-01 Implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China Published by China National Standardization Administration ForewordThis standard is in accordance with GB/T 31476-2015 "High-quality solder for internal interconnection of electronic assembly" and GB/T 31474-2015 "Electronic assembly "Fluxes for High-Quality Interconnects" constitutes a complete standard for electronic soldering materials. This standard was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that some elements of this document may involve patents. The issuer of this document is not responsible for identifying these patents. This standard was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47). Drafting organizations of this standard. Zhejiang Qiangli Soldering Materials Co., Ltd., Shenzhen Vettel Chemical Development Industrial Co., Ltd., Xiamen Timely Rain Solder Co., Ltd., Yunnan Tin Industry Co., Ltd., Special Material Quality Supervision and Inspection Center of the Ministry of Information Industry, China Electronic Technology Standardization Research Institute, Chongqing University of Science and Technology, Faith Metals (Shenzhen) Co., Ltd. Co., Ltd., Guangdong Anchen Tin Products Manufacturing Co., Ltd., Guangxi Taixing Electronic Welding Materials Co., Ltd. Drafters of this standard. Zhao Tuqiang, Wu Jing, Sun Hongri, Qin Junhu, He Xiukun, Chen Fang, Yao Wenbin, Wang Jiangong, Yu Honggui, Tong Shi, Wu Yongtian. High quality solder paste for electronic assembly1 ScopeThis standard specifies the classification, technical requirements, test methods, and inspection of high-quality internal solder pastes for electronic assembly (referred to as solder paste). Rules and product marking, packaging, transportation, storage. This standard applies to solder paste used for soldering when surface-mounted components and electronic circuits are interconnected.2 Normative referencesThe following documents are essential for the application of this document. For dated references, only the dated version applies to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 2040 pure copper plate GB/T 2828.1 Sampling inspection procedures for counts. Part 1. Sampling plan for batch inspections retrieved by acceptance quality limit GB/T 10574 (all parts) Methods for chemical analysis of tin-lead solder GB/T 31476 Solder for high quality internal interconnection of electronic assembly GB/T 31474 Flux for high-quality internal interconnection of electronic assembly YS/T 746 (all parts) Chemical analysis method for lead-free tin-based solder3 terms and definitionsThe following terms and definitions apply to this document. 3.1 Slump When the solder paste coating test is performed, the shape of the solder paste pattern printed on the substrate changes, which is a type of solder paste. defect. 3.2 Tackiness The amount of solder paste adhesion to components and the change in solder paste adhesion after printing time increases. 3.3 Wetting The molten solder spreads on the surface of the base metal and forms a smooth solder layer, and the angle between the molten solder and the base metal is less than 90 °. 3.4 Thinner Liquid preparations or pastes with or without activator, added to the solder paste to adjust the viscosity and solids of the solder paste content.4 Classification and naming marks4.1 Classification Solder paste can be divided into leaded solder paste and lead-free solder paste according to alloy composition. For the classification of flux in solder paste, see GB/T 31474. Flux for electronic assembly high quality internal interconnection. 4.2 Named tags The naming mark of the solder paste should meet the following requirements. Example. If the solder alloy grade of a solder paste is S-Sn5PbAgA, the flux type is identified as ROM1, and the mass fraction of the alloy powder in the solder paste is 85%, alloy powder type is type 1, viscosity is 800Pa · s, then it is expressed as follows. Sn5PbAgA-ROM1-85-1-800Pa · s.5 Requirements5.1 Chemical composition The chemical composition of the solder powder in the solder paste should meet the requirements of GB/T 31475. 5.2 Impurity content The impurity content of solder powder in solder paste should meet the requirements of GB/T 31475. 5.3 Size distribution The size distribution and specification type of solder powder in solder paste shall comply with the requirements in Table 1. Table 1 Summary of solder powder size distribution and specifications 5.4 Shape The shape of the solder powder should be spherical, and the maximum ratio of long axis to short axis of type 1, 2 and 3 solder powder and type 4, 5 and 6 solder powder is 1.5 respectively. The mass of the spherical powder and the spherical powder of 1.2 should be no less than 90%. 5.5 Alloy powder content The mass fraction of the alloy powder in the solder paste should be in the range of 65% ~ 96%. 5.6 Viscosity Solder paste viscosity should be within ± 15% of the nominal value of the product. 5.7 Collapse 5.7.1 0.20mm template test Use a 0.20mm stencil to print a 0.63mm × 2.03mm graphic. When the test method 6.5.2.2a) is used, the spacing is not less 0.56mm, there should be no bridging between the solder paste patterns; when the test method 6.5.2.2b) is used, the pitch is not less than 0.63mm, the solder There should be no bridging between the paste patterns. Use a 0.20mm stencil to print a 0.33mm × 2.03mm graphic. When the test method 6.5.2.2a) is used, the pitch is not less than 0.25mm, there should be no bridging between the solder paste patterns; when the test method 6.5.2.2b) is used, the pitch is not less than 0.30mm, the solder There should be no bridging between the paste patterns. 5.7.2 0.10mm template test Use a 0.10mm stencil to print 0.33mm × 2.03mm graphics. When the test method 6.5.2.2a) is used, the pitch is not less than 0.25mm, there should be no bridging between the solder paste patterns; when the test method 6.5.2.2b) is used, the pitch is not less than 0.30mm, the solder There should be no bridging between the paste patterns. Print a 0.20mm × 2.03mm graphic with a 0.10mm stencil. When the test method 6.5.2.2a) is used, the pitch is not less than 0.175mm, there should be no bridging between the solder paste patterns; when the test method 6.5.2.2b) is used, the pitch is not less than 0.20mm, the solder There should be no bridging between the paste patterns. 5.8 Tin Bead Test The solder paste bead test is rated according to the provisions of Table 2, and the test results cannot be lower than level 2. Table 2 Tin ball test evaluation standards Grade test results 1 After each solder paste spot is melted, a single solder ball is formed, and no more than 1 independent solder ball appears next to any solder ball 2 After each solder paste spot is melted, a single solder ball is formed, and the number of independent solder beads appearing beside any solder ball is not more than 3. After each solder paste spot is melted, a single solder ball is formed, and the number of independent solder beads appearing beside any solder ball is more than three, but these Tin beads have not formed a semi-continuous ring arrangement After each solder paste spot is melted, a single solder ball is formed, and there are a large number of solder beads next to any solder ball, and a semi-continuous ring row is formed. Column; or after the solder paste melts, a diameter greater than 75 μm (or greater than 50 μm) is formed next to the solder ball. Solder paste) Note. For solder paste made with type 1, 2, 3 or 4 type alloy powder, the diameter of each solder ball should not be greater than 75 μm; for type 5 or 6 For solder paste made of alloy powder, the diameter of each solder ball should not be greater than 50 μm. 5.9 Adhesiveness When tested in accordance with 6.8, the minimum adhesion of solder paste after printing should be within ± 30% of the nominal value of the product. 5.10 Wettability When tested in accordance with 6.9, the wettability of the solder paste should meet the level 1 or 2 evaluation criteria in Table 3. Table 3 Solder Paste Wettability Evaluation Standards Grade test results1 The molten solder in the solder paste wets the specimen and spreads beyond the boundaries of the area to which the solder paste is applied2 The area where the solder paste is applied on the sample is completely wetted by the molten solder in the solder paste3 Part of the sample (area ratio is not greater than 15%) The area where the solder paste is applied is not wet by the molten solder in the solder paste It is obvious (area ratio greater than 15%) on the sample that the area where the solder paste is applied is not wet by the molten solder in the solder paste, or the molten solder in the solder paste Material to form two or more solder wetted surfaces 5.11 Flux Performance The properties and types of flux in solder paste should meet the requirements of GB/T 31474.6 Test method6.1 Chemical composition The chemical composition of solder paste alloy powder is measured according to GB/T 10574 or YS/T 746. 6.2 Test method for size distribution of alloy powder 6.2.1 Instruments and materials The required equipment and materials are as follows. a) thinner; b) stirring rods; c) 50mL measuring cup; d) Microscope. 100 times magnification; e) Measuring eyepiece. scale 10μm; f) microscope slides; g) Balance. accuracy ± 0.01g. 6.2.2 Test procedure Stir the solder paste at room temperature, weigh 1g, put it into a clean measuring cup and add 4g thinner, stir and dilute Flux and solder paste to make it a homogeneous mixture. Place a small drop of the mixture on a clean microscope slide and cover it with a clean glass Sheet, press gently to spread it between the two glass sheets. Observe the size of about 50 alloy powder particles in the field of view with a microscope. Measure their long axis and short axis, calculate their mass one by one, calculate the total amount and its mass fraction according to the size distribution file, and record according to Table 4. Table 4 Test record of size distribution of alloy powder Note. The shape of the alloy powder particles is judged based on the measurement of the major and minor axes and recorded according to 5.4. 6.3 Alloy powder content 6.3.1 Instruments and materials The required equipment and materials are as follows. a) Balance. accuracy ± 0.01g; b) crucible; c) heating plate; d) Glycerol. analytical grade; e) Anhydrous ethanol. analytical grade. 6.3.2 Inspection steps Stir the solder paste at room temperature, weigh 10g ~ 15g into a clean crucible and add 30mL glycerol. The crucible is heated for 15min under the condition that the liquidus temperature (or eutectic point) of the alloy powder exceeds the temperature of 25 ° C to 30 ° C, so that the alloy powder is fully melted and cooled. When it reaches room temperature, the alloy is allowed to solidify. The solidified alloy block is taken out, and its surface is cleaned with anhydrous ethanol. After drying, the mass is weighed with a balance. 6.3.3 Calculation Calculate the mass fraction of alloy powder in solder paste according to formula (1). 6.4 Viscosity 6.4.1 Instruments and materials The required equipment and materials are as follows. a) Brookfield T-pin rotor or helical-pin rotor viscometer; b) Malcom screw pump viscometer. You can choose any of the above viscometers or other equivalent rheometers for testing. 6.4.2 Test samples Before the test, the solder paste samples should be left to stand in an environment of 25 ℃ ± 1 ℃ for a period of not less than 24h. When testing with a Brookfield T-pin rotor viscometer, the sample volume should be sufficient to fill the test container (the diameter and height of the test container (Degrees are not less than 5cm); when using Brookfield spiral needle rotor or Malcom screw pump viscometer for testing, the sample size is about Inspection container volume 60%. 6.4.3 Test procedure 6.4.3.1 Sample preparation Prepare the specimen according to the following procedure. a) Open the container containing the solder paste sample, remove the inner cover, and scrape the sample adhered to the outer cover, inner cover and container wall back into the container; b) Using a spatula, stir the sample evenly (1min ~ 2min), taking care to prevent air from mixing into the sample; c) Transfer an appropriate amount of sample into the test container, taking care to prevent the introduction of air (if the size of the container Required, this step is not required); d) The test container is allowed to stand in a constant temperature environment of 25 ℃ ± 0.25 ℃ until the temperature and rheological properties of the sample reach a stable state. The interval should be not less than 15min, depending on the nature of the solder paste sample, the standing time can be appropriately extended. 6.4.3.2 Test 6.4.3.2.1 Brookfield T-pin Rotor Viscometer Set the rotation speed to 5r/min and select a suitable T-pin rotor (the selection of the rotor to ensure that the torque percentage reading is between 10% and 100% Within range. If the viscosity is below 300kcp, select TC type rotor; when the viscosity is 300kcp ~ 1600kcp, select TF type (Rotor); adjust the movable range of the lifting bracket so that the T-pin rotor can be immersed in the sample to a depth of 0.3cm ~ 2.8cm Up and down movement between fields (minimum distance between the rotor and the bottom of the test container is not less than 1cm); set a test period of 5 cycles (lift and lower The up and down movement of the bracket is one cycle at a time); start the test, and continuously record the viscosity of the rotor during the up and down reciprocating movement of the rotor with the lifting bracket Changes in value. During the test, the sample temperature should be kept at 25 ℃ ± 0.25 ℃. 6.4.3.2.2 Brookfield Spiral Needle Rotor or Malcom Spiral Pump Viscometer Dip the instrument sensor into the solder paste sample, pay attention to prevent the sample from covering the screw pump outlet; set the speed to 10r/min; start measuring Try to record the data when the reading is stable for more than 1min and no longer changes. During the test, the sample temperature should be kept at 25 ℃ ± 0.25 ℃. 6.4.4 Evaluation of results 6.4.4.1 Brookfield T-pin Rotor Viscometer Take the maximum and minimum viscosity values measured in the first two cycles and record them as η1 and η2 respectively; take the maximum and minimum viscosity measured in the last two cycles The values are recorded as η3 and η4, respectively. Calculate the viscosity values η and η 'of the solder paste samples according to equations (2) and (3). η = (η1 η2)/2 (2) η '= (η3 η4)/2 (3) If η ≤ (1 10%) η ', the final viscosity of the sample is recorded as η'; if η > (1 10%) η ', the result is considered invalid, and the sample is allowed to stand still and stable After the test is repeated, the result is judged in the above manner. 6.4.4.2 Brookfield Spiral Needle Rotor or Malcom Spiral Pump Viscometer Record the stable data, which is the viscosity value of the solder paste sample. 6.5 Collapse test 6.5.1 Instruments and materials The required equipment and materials are as follows. a) stencil (missing printing plate). according to the regulations of Figure 1 and Figure 2 respectively; b) Sample carrier. Frosted glass sheet with a size of 76mm × 25mm and a thickness of at least 1mm is used as the standard sample carrier. Equivalent to alumina substrate or epoxy glass fiber cloth substrate; the number of sample carriers is 4; c) scraper; d) temperature controlled heating furnace; e) 10x magnifying glass. 6.5.2 Test procedure 6.5.2.1 Sample preparation Prepare the specimen according to the following procedure. a) Use two stencils with different thicknesses (different opening sizes) (see Figure 1 and Figure 2) to print solder paste patterns on two carriers to form For 4 samples, the printed solder paste pattern should be uniform, and there should be no residual solder paste outside the pattern; b) Two samples printed from each stencil are coded as 1 The required equipment and materials are as follows. a) Metal stencil. For metal paste used for solder paste of type 1, 2, 3 and 4 alloy powder, its size is 76mm × 25mm × 0.2mm, there must be at least three circular leak holes with a diameter of 6.5mm and a center distance of 10mm on the metal template. Du Cai Metal stencils for solder pastes with type 5 and 6 alloy powders.The dimensions are 76mm × 25mm × 0.1mm. There must be at least 3 circular leak holes with a diameter of 1.5mm and a center distance of 10mm on the board; b) Sample carrier. The sample carrier is an alumina substrate, with a thickness of 0.60mm to 1.00mm, and a minimum length and width of 75mm and 25mm. Other non-wetting substrates can also be used; c) heating plate; d) surface thermometer; e) Magnifying glass. 10 times to 20 times; f) Microscope. 100x ~ 150x; g) Measuring eyepiece. scale 10μm; h) scraper; i) solvents; j) Deionized water. 6.6.2 Test procedure After the solder paste at room temperature is stirred evenly, it is printed on the sample carrier with a prescribed metal template to form a sample. kind. The solder paste should fill each leak of the metal template and scrape it. Place the sample at a temperature of 25 ° C ± 2 ° C and a relative humidity of 50% ± 10% environment for standby; the first and second samples are 15min ± 5min and 240min ± 15min after solder paste printing, respectively It is placed on a heating plate for heating.The temperature of the heating plate should be controlled above the liquidus (or eutectic point) temperature of the alloy powder in the solder paste. In the range of 25 ℃ ~ 30 ℃, after the alloy powder in the solder paste is melted and shaped, the sample is taken out from the hot plate in a horizontal manner, and the alloy powder is After melting and setting, the contact time of the sample on the hot plate should not exceed 10s. 6.6.3 Evaluation of results After the sample is cooled to room temperature, check whether the sample has tin beads with a magnifying glass; observe the tin beads next to the solder ball with a microscope and measure Tin bead size; compare the test results with the evaluation criteria in Table 2 to determine the grade of the tin bead test results.Figure 3 shows the results of the tin bead test results. Typical photo. a) preferred b) acceptable c) difficult to accept d) unacceptable Figure 3 Results of the tin bead test 6.7 Adhesion test 6.7.1 Instruments and materials 6.7.1.1 Other equipment that can accurately determine adhesion at the specified speed during the test. The test equipment shall have a diameter of 5.10mm ± 0.13mm stainless steel probe with smooth and flat bottom surface, and can be adjusted to be parallel to the s......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 31475-2015_English be delivered?Answer: Upon your order, we will start to translate GB/T 31475-2015_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 31475-2015_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 31475-2015_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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