GB/T 31474-2015 English PDF

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GB/T 31474-2015: Soldering fluxes for high-quality interconnections in electronics assembly
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 31474-2015	449	Add to Cart	4 days	Soldering fluxes for high-quality interconnections in electronics assembly	Valid

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GB/T 37201   GB/T 34482   GB/T 34190   GB/T 31476   GB/T 31475   

Basic data

Standard ID: GB/T 31474-2015 (GB/T31474-2015)
Description (Translated English): Soldering fluxes for high-quality interconnections in electronics assembly
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H21
Classification of International Standard: 29.045
Word Count Estimation: 21,236
Date of Issue: 2015-05-15
Date of Implementation: 2016-01-01
Quoted Standard: GB 190; GB/T 191; GB/T 2040; GB/T 2423.16; GB/T 2423.32-2008; GB/T 8145; GB/T 21652
Regulation (derived from): National Standard Announcement 2015 No. 15
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This Standard specifies the electronic assembly with high quality interconnect with the flux (the flux) classification, technical requirements, test methods, marking detection rules and products, packaging, transportation, storage. This Standard applies to the printed board assembly and electrical and electronic circuits with contacts soldering flux.

GB/T 31474-2015: Soldering fluxes for high-quality interconnections in electronics assembly

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Soldering fluxes for high-quality interconnections in electronics assembly ICS 29.045 H21 National Standards of People's Republic of China Electronics assembly quality interconnect Flux Issued on. 2015-05-15 2016-01-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Table of Contents

Introduction Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 4 Category 2 5 requires 3 6 Test Method 4 7 Inspection rules 14 8 packaging, labeling, transportation and storage 15 Appendix A (normative) of the solder paste and solder flux extraction 17

Foreword

This standard and GB/T 31475-2015 "high-quality electronic assembly interconnect with solder paste" and GB/T 31476-2015 "electronics assembly High quality interconnect solder "to form a complete electronic welding materials standard series. This standard was drafted in accordance with GB/T 1.1-2009 given rules. Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents. The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard by the National Standardization Technical Committee of the printed circuit (SAC/TC47) centralized. This standard was drafted. Shenzhen special dual CD-Chemical Development Co., Ltd., convinced that love with metal (Shenzhen) Co., Ltd., Chongqing Institute of Technology University, Ministry of Information Industry materials for Quality Supervision and Inspection Center, China Electronics Standardization Institute, Zhejiang strong solder materials Limited Secretary, Guangdong Anson tin products Manufacturing Co., Ltd., Yunnan Tin Co., Zhejiang, a far Electronic Technology Co., Ltd., Guangzhou Xitai Electronic welding material Material Limited. Drafters of this standard. Wang, Yu Yu, Chen Fang, Wang Jingang Zhao and strengthen the country, Dr display, Li Zhihong, Cyrus East, Yuhong Gui, Wu Yongtian. Electronics assembly quality interconnect Flux

1 Scope

This standard specifies the use of high-quality electronic assembly interconnect with flux (flux abbreviation) classification, technical requirements, test methods, inspection Identification and measurement rules for products, packaging, transportation, storage. This standard applies to electrical and electronic PCB assembly and soldering circuit contacts with flux.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB 190 packaging and marking of dangerous goods GB/T 191 Packaging - Pictorial signs GB/T 2040 copper plate GB/T 2423.16 Environmental testing for electric and electronic products Part 2. Test methods - Test J and guidance. Mould growth GB/T 2423.32-2008 Environmental testing for electric and electronic products Part 2. Test methods - Test Ta. the wetting balance method Weldability GB/T 8145 gum rosin GB/T 21652 Copper and copper alloy wire

3 Terms and Definitions

The following terms and definitions apply to this document. 3.1 Flux type fluxtype Classified according to the main component of the flux including rosin, resin type, organic type and inorganic type. Rosin refers to the basic component Flux from coniferous plant extract and purified natural oleoresin, the symbol for the RO; resin-type refers to the basic component is a natural addition to gum rosin and Flux synthetic resin, the symbol for the RE; organic type refers to the basic component of organic materials in addition to rosin and resin flux, symbol The OR; inorganic type refers to inorganic acids and inorganic salt solution, symbol IN. 3.2 Halogen content halidecontent In order to improve the content of the flux weldability and mixed or compound added to the active substance. Chloro iodo wherein bromo are for the same test, the results of Chlorine content meter. 3.3 Wetting wetting Molten solder is spread on the surface of the base metal, and the formation of a smooth layer of solder, the angle between the base metal which is less than 90 °. 3.4 Wetting time wettingtime When tested using the wetting balance method, starting from the sample into contact with the surface of the molten solder to a contact angle of 90 ° at the time, in seconds (s) dollars. ......

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