GB/T 31471-2015 English PDF

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GB/T 31471-2015: General specification for metal foil for printed circuits
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 31471-2015	489	Add to Cart	4 days	General specification for metal foil for printed circuits	Valid

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Basic data

Standard ID: GB/T 31471-2015 (GB/T31471-2015)
Description (Translated English): General specification for metal foil for printed circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L30
Classification of International Standard: 31.18
Word Count Estimation: 23,257
Date of Issue: 2015-05-15
Date of Implementation: 2016-01-01
Quoted Standard: GB/T 2036; GB/T 8888; GB/T 29847-2013
Regulation (derived from): National Standard Announcement 2015 No. 15
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This Standard specifies the printed circuit has a carrier (film or foil) supports and unsupported supporting metal foil logo, code, the general technical requirements, quality assurance regulations, test methods, packaging, marking and storage and transportation requirements. This Standard applies to rigid, flexible printed circuit metal foil.

GB/T 31471-2015: General specification for metal foil for printed circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
General specification for metal foil for printed circuits ICS 31.180 L30 National Standards of People's Republic of China Metal foil for printed circuits General specification Issued on. 2015-05-15 2016-01-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Table of Contents

Preface Ⅰ 1 Scope 1 2 Normative references 1 3 Terms and definitions 4 metal foil identification code, type 2 4.1 2 metal foil logo 4.2 Code 2 4.3 Model of the metal foil 4 5 Requirements 4 5.1 General 4 5.2 General requirements 4 5.3 Exterior 5 5.4 Size 5 5.5 Physical Performance Requirements 7 5.6 process requirements 8 5.7 Particular requirements for the metal foil 8 6 Quality Assurance provisions 9 9 6.1 Responsibility for Inspection 6.2 test equipment and test equipment 9 6.3 Test conditions 9 6.4 Inspection classification 10 6.5 Identification Test 10 6.6 Quality conformance inspection 10 7 13 test method 13 7.1 Appearance 7.2 Dimensions 14 7.3 Physical Properties 14 15 7.4 Process Performance 15 7.5 Special Requirements 8 packaging, labeling and transport storage 16 8.1 Packaging 16 8.2 mark 16 8.3 Transport and storage 16 9 order documents 16 Appendix A (informative) domestic and foreign PCB with metal foil standard models and detailed specifications table number 18 References 19

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points. This standard was drafted. Guangdong Jia Yuan Technology Co., Ltd., Xianyang Reid Technology Co., Ltd., China Electronics Standardization Hospital, Anhui copper foil crown Limited, Kingboard Fogang Industrial Co., Ltd., Hubei Branch foil Technology Limited, Qinghai electronic materials industry made Exhibition Co., Ltd., Shandong Jinbao Electronics Co., Ltd. Heze Guangyuan Copper Strip. The main drafters of this standard. High Yan Ru, Wang Junfeng, Chen Dingmiao, Li Yongzhen, Wang Xiang, Qi tube, Peikuai Chuan, Chen Shi, Ding Shiqi, Liu Xueping. Metal foil for printed circuits General specification

1 Scope

This standard specifies the printed circuit has a carrier (film or foil) support and unsupported supporting metal foil (hereinafter referred to as a metal foil) the identity of behalf No, the general technical requirements, quality assurance provisions, test methods, packaging, marking and storage and transportation requirements. This standard applies to rigid, flexible printed circuit metal foil.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 2036 Printed Circuit Terminology GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation and storage GB/T 29847-2013 Test method for copper foil for printed boards

3 Terms and Definitions

GB/T 2036 defined by the following terms and definitions apply to this document. 3.1 Elongation elongation When the specimen fracture under tensile load, the effective portion of the sample from the increment between the reticle and the reticle between the initial distance ratio, expressed as a percentage FIG. 3.2 Tensile strength tensilestrength When the specimen fracture under tensile load, maximum load ratio of the average cross-sectional area of \u200b\u200bthe specimen. 3.3 Contour factor profilefactor The average total thickness of the metal foil, the thickness of the sample exceeds the amount specified by the actual mass per unit area of \u200b\u200bthe metal foil and sample density calculations. 3.4 Profile of foilprofile The processing and (or) enhanced adhesion treatment causes roughness of the metal foil surface. 3.5 Arithmetical mean deviation arithmeticalmeandeviationoftheprofile Ra In measuring length, from the centerline to the rough outline of the arithmetic mean of all absolute distances. 3.6 10.00 microscopic roughness height tenpointheightofirregularities Rz In measuring length, five consecutive maximum peak-to-average distance between the trough. ......

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