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GB/T 23611-2023 English PDF

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GB/T 23611-2023: Gold and gold alloy targets
Status: Valid

GB/T 23611: Historical versions

Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 23611-2023189 Add to Cart 3 days Gold and gold alloy targets Valid
GB/T 23611-2009239 Add to Cart 2 days Gold target Obsolete

Similar standards

GB/T 23520   GB/T 23276   GB/T 23277   GB/T 23608   GB/T 23610   

Basic data

Standard ID: GB/T 23611-2023 (GB/T23611-2023)
Description (Translated English): Gold and gold alloy targets
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H68
Classification of International Standard: 77.150.99
Word Count Estimation: 10,135
Date of Issue: 2023-08-06
Date of Implementation: 2024-03-01
Older Standard (superseded by this standard): GB/T 23611-2009
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 23611-2023: Gold and gold alloy targets

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 77.150.99 CCSH68 National Standards of People's Republic of China Replace GB/T 23611-2009 Gold and gold alloy targets Published on 2023-08-06 2024-03-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Foreword

This document complies with the regulations of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Custom drafting. This document replaces GB/T 23611-2009 "Gold Target". Compared with GB/T 23611-2009, except for structural adjustments and editorial changes In addition, the main technical changes are as follows. a) Added a "Terms and Definitions" chapter (see Chapter 3); b) Added AuGe and AuGeNi alloy target varieties (see 4.1.2); c) Added structural form and supply status (see 4.1.4, 4.1.5); d) Added technical requirements and test methods for AuGe and AuGeNi alloy targets (see 5.1 and 6.1); e) Added the chemical composition list of gold targets (see 5.1); f) Added target welding quality requirements (see 5.5); g) The outer dimensions and allowable deviations of the gold target have been changed (see 5.6, 3.4 of the.2009 edition); h) Added rectangular target dimensions and allowable deviation requirements (see 5.6). Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the China Nonferrous Metals Industry Association. This document is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243). This document was drafted by. Youyan Yijin New Materials Co., Ltd., Beijing Nonferrous Metals and Rare Earth Application Research Institute Co., Ltd., Guiyan Platinum Industry Co., Ltd., Zijin Mining Group Gold Smelting Co., Ltd., Youyan Resources and Environmental Technology Research Institute (Beijing) Co., Ltd., Shenzhen Zhong Chengda Applied Materials Technology Co., Ltd. The main drafters of this document. Luo Yao, Lu Baoguo, Jiang Xuan, Wang Peng, Huang Xiaomeng, Dou Chengliang, Guan Jing, Luo Yuanhui, Duan Huaying, Liu Manmen, Zhu Wuxun, Zhang Bohou, Lin Fengxian, Wu Weihuang, Huang Yongbiao. This document was first published as GB/T 23611-2009 "Gold Target" in.2009, and this is the first revision. Gold and gold alloy targets

1 Scope

This document stipulates the product classification, technical requirements, test methods, inspection rules and marking, packaging, transportation and storage of gold and gold alloy targets. and accompanying documents and order form contents. This document applies to gold and gold alloy targets for semiconductor electronic devices (hereinafter referred to as "targets").

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 6394 Method for determination of average grain size of metals GB/T 8651 Ultrasonic plate wave flaw detection method for metal sheets GB/T 11066.1 Methods for chemical analysis of gold - Determination of gold content Fire assay GB/T 11066.10 Methods for chemical analysis of gold - Determination of silicon content Molybdenum blue spectrophotometry GB/T 11066.11 Methods for chemical analysis of gold - Part 11.Magnesium, chromium, manganese, iron, nickel, copper, palladium, silver, tin, antimony, lead and bismuth content Determination by inductively coupled plasma mass spectrometry GB/T 15077 Methods for measuring geometric dimensions of precious metals and their alloy materials GB/T 25934 (all parts) Chemical analysis methods for high purity gold YS/T 837 Ultrasonic inspection method for sputtering target-back plate bonding quality

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 Target In the cathode portion of sputter deposition technology, the cathode material is bombarded with positively charged cations in the form of molecules, atoms, or ions separated from the cathode and deposited on the anode surface. Note. The target material consists of target blank and backing plate. 3.2 target blank targrtblank The material used as sputter material on the cathode. 3.3 backingplate Material used to support or secure the target. Note. The target blank and the backing plate can be connected by welding (such as brazing, electron beam welding, diffusion welding, etc.), mechanical compounding, bonding, etc.
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