GB/T 15879.4-2019 English PDF

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GB/T 15879.4-2019: Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 15879.4-2019	344	Add to Cart	4 days	Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages	Valid

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Basic data

Standard ID: GB/T 15879.4-2019 (GB/T15879.4-2019)
Description (Translated English): Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L55
Classification of International Standard: 31.080
Word Count Estimation: 18,159
Date of Issue: 2019-08-30
Date of Implementation: 2019-12-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 15879.4-2019: Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Mechanical standardization of semiconductor devices - Part 4. Coding system and classification into forms of package outlines for semiconductor device packages ICS 31.080 L55 National Standards of People's Republic of China Mechanical standardization of semiconductor devices Part 4. Dimensions of semiconductor device packages Classification and coding system Part 4. Codingsystemandclassificationintoformsofpackageoutlinesfor 半导体devicepackages (IEC 60191-4..2013, IDT) Published on.2019-08-30 2019-12-01 implementation State market supervision and administration China National Standardization Administration issued

Content

Foreword I 1 Scope 1 2 Encoding system for semiconductor device package outline 1 3 Classification of semiconductor device package outlines 1 4 Encoding system for semiconductor device package 1 4.1 General 1 4.2 New package code 2 4.3 Descriptive naming 2 4.3.1 General description 2 4.3.2 The simplest descriptive naming 2 4.3.3 Terminal position 3 4.3.4 Package material 4 4.3.5 Specific Package Features 4 4.3.6 Number of outlets and number of terminals 5 4.3.7 Details 6 5 package outline type code 6 Appendix A (informative) Descriptive naming application example 8 Appendix B (informative) Derivatives and applications of descriptive coding systems Common package names 13

Foreword

GB/T 15879 "Mechanical Standardization of Semiconductor Devices" has been or is planned to be released as follows. --- Part 1. General rules for drawing outlines of discrete device packages; --- Part 2. Size; --- Part 3. General rules for drawing outline drawings of integrated circuits; --- Part 4. Classification and coding system for the outline of semiconductor device packages; ---Part 5. Recommended values for automated tape carrier integrated soldering (TAB); --- Part 6. General rules for drawing outlines of surface mount semiconductor device packages. This part is the fourth part of GB/T 15879. This part is drafted in accordance with the rules given in GB/T 1.1-2009. This section uses the translation method equivalent to IEC 60191-4.2013 "Mechanical standardization of semiconductor devices Part 4. Semiconductor devices Classification and coding system for package shapes. Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section was drafted. The 13th Research Institute of China Electronics Technology Group Corporation. The main drafters of this section. Bloomberg, Wu Yaguang, Li Lixia, Zhao Jing, Song Yuxi, Zhang Yijun. Mechanical standardization of semiconductor devices Part 4. Dimensions of semiconductor device packages Classification and coding system

1 Scope

This part of GB/T 15879 specifies the classification and naming methods for the package shape of semiconductor devices, as well as packaging for semiconductor devices. A systematic approach to general descriptive naming. This descriptive naming method provides a useful communication tool, but does not ensure that the same encoded package is interchangeable.

2 coding system for semiconductor device package outline

The coding scheme for the following semiconductor device package outlines is applicable to the relevant mechanical drawings and documents. a) Part 1. A three-digit serial number (000~999) indicating the numbering sequence; b) Part II. a single letter representing the outline drawing (see Chapter 3); c) Part III. Represents a two-digit serial number derived from the outline drawing (00~99). The prefix P represents a temporary figure number. Example. ---101A00; ---050G13; ---P101F01.

3 Classification of semiconductor device package outlines

The classification rules for the outline of semiconductor device packages are as follows. a) Form A. single-ended lead; b) Form B. heat sink installation; c) Form C. bolt mounting; d) Form D. axial lead; e) Form E. surface mounting; f) Form F. single-ended heat sink installation; g) Form G. double column and four columns; h) Form H. No lead in the axial direction.

4 coding system for semiconductor device package

4.1 General A standard coding system is a method of identifying the physical characteristics of a semiconductor device package. The coding system contains at least two representation packages Shape type letters. The coding system can be extended by optional parts, and the user can select as needed to provide additional package information. ......

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