GB/T 15878-2015 English PDFUS$339.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 15878-2015: Semiconductor integrated circuits -- Specification of lead frames for small outline package Status: Valid GB/T 15878: Historical versions
Basic dataStandard ID: GB/T 15878-2015 (GB/T15878-2015)Description (Translated English): Semiconductor integrated circuits -- Specification of lead frames for small outline package Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L56 Classification of International Standard: 31.200 Word Count Estimation: 16,120 Date of Issue: 2015-05-15 Date of Implementation: 2016-01-01 Older Standard (superseded by this standard): GB/T 15878-1995 Quoted Standard: GB/T 2423.60-2008; GB/T 2828.1-2012; GB/T 7092; GB/T 14112-2015; GB/T 14113; SJ 20129 Regulation (derived from): National Standard Announcement 2015 No. 15 Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This Standard specifies the semiconductor integrated circuit small outline package (SOP) of the lead frame (hereinafter referred to as the lead frame) of technical requirements and inspection rules, this standard is applicable to a semiconductor integrated circuit small outline package stamped leadframe. GB/T 15878-2015: Semiconductor integrated circuits -- Specification of lead frames for small outline package---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Semiconductor integrated circuits. Specification of leadframes for small outline package ICS 31.200 L56 National Standards of People's Republic of China Replacing GB/T 15878-1995 The semiconductor integrated circuit Small outline package leadframe Specification Issued on. 2015-05-15 2016-01-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released Table of ContentsPreface Ⅰ 1 Scope 1 2 Normative references 1 3 Terms and definitions 4 technical requirements 4.1 size of the lead frame 1 4.2 leadframe shape and position tolerances of 1 4.3 appearance of the lead frame 2 4.4 leadframe plating 3 4.5 intensity of the lead frame outer leads 3 4.6 copper peel test 3 4.7 silver peel test 3 5 Inspection Rules 3 Constituting 5.1 Inspection Lot 3 5.2 Qualification approval procedures 4 5.3 Quality conformance inspection 4 6 6 Ordering Information 7 signs, packaging, transportation, storage 6 7.1 marks, packaging 6 7.2 Transport, storage 7 Appendix A (normative) mechanical measuring lead frame 8ForewordThis standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard replaces GB/T 15878-1995 "small outline package leadframe norms." This standard and GB/T 15878-1995 compared to the main changes are as follows. --- According to the standard range, the standard name of the original standard was revised to "small outline integrated circuit semiconductor package leadframe specification"; --- About Normative references. increase the introductory phrase; sampling standards set by GB/T 2828.1-2012 instead of SJ/Z9007-87; increase Plus references GB/T 2423.60-2008, SJ20129; --- 4.1 standard from "Design" to "lead frame size", about the content of the original standard fine tune the depth and metal gap Rounded to 4.2, and the original standard "fine nip" of the contents are incorporated into the "coining depth" articles; --- Of the standard "4.2 leadframe shape and position tolerances" in the corresponding provisions of the order have been adjusted, and increases the chip bonding area Subsidence and the relevant requirements of the lead frame inside position tolerances; --- Revised standard for "scoliosis" requirements (see 4.2.1). the original standard specifies only 150mm in length direction, does not exceed Over 0.5mm, this standard over the entire length of the predetermined nominal; --- Revised standard on the "curl" requirements (see 4.2.2). the original standard specifies only texturized less than 0.5mm, the root of this standard According to the thickness of the material were carried out provision; --- Modify the requirements of the standard "twisted strip" (see 4.2.4). the original standard specifies only twist on every frame does not exceed 0.51mm, this standard will be revised to frame twist twisted strips, and were based on a predetermined thickness of the material; --- Revised standard on the "twisted wire" requirements (see 4.2.5). the original standard specifies the lead angle and twisted lead width The maximum offset this standard removed the lead predetermined maximum width offset; --- Original standard does not consider the effect of depth on the coining coining width simply specifies the size range coining depth. The revised standard It is. to ensure the coining width not less than 90% lead width conditions, the coining depth of no more than 30% of the material thickness, and its reference Value 0.015mm ~ 0.06mm (see 4.2.6); --- The "metal gap" to "insulation gap" and revised the standard for "insulating gap" requirements (see 4.2.7). The original standard gauge Set "between the respective inner leads of the lead frame, the chip and the distance between the inner lead bonding area is not less than 0.152 mm", this modified standard To "nip spacing and fine finishing two adjacent nip between the endpoints and the endpoint chip bonding interval interval is greater than 0.076mm"; --- Revised standard on the "die attach area slope" requirements (see 4.2.9). the original standard were provided for in the fight and did not play the concave recess Maximum slope member under the provisions of the standard uniform for the maximum inclination in the length or width of each size 2.54mm 0.05mm; --- Original standard "chip bonding area flatness" and "die attach area flatness" Uniform provisions for the "flatness chip bonding area" (See 4.2.11); --- Revised standard on the "glitch" requirements (see 4.3.1). cancel the original standard different even in different regions within and outside the vertical ribs burr Requirements, the standard uniform provisions of 0.025mm; --- Revised standard on the "pits, dents and scratches" requirements (see 4.3.2). increases in raw scratches on the basis of criteria relating to Claim; --- Revised standard on the "local silver layer thickness" requirements (see 4.4.1). the original standard specifies only a partial thickness of the silver layer, this Standard on the local silver layer thickness and any point were provisions; --- Added "copper peel test," the relevant requirements (see 4.6); --- Added "Silver peeling test" the relevant requirements (see 4.7); --- Standard "5 Inspection Rules" in the corresponding modification of terms, referring to GB/T 14112-2015 inspection rules, and adds Kam Given approval procedures and quality conformance inspection of relevant content; --- Amend the relevant requirements of the standard for "storage". the original standard plated shelf life of three months, the provisions of this standard is 6 months (See 7.2); --- Increasing the normative Appendix A "lead frame mechanical measurements." Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents. The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard by the National Standardization Technical Committee of the semiconductor device (SAC/TC78) centralized. This standard was drafted. Xiamen Yonghong Technology Limited. The main drafters of this standard. Lingui Xian, Wang Feng Tao, Shenrui Qin. This standard replaces the standards previously issued as follows. --- GB/T 15878-1995. The semiconductor integrated circuit Small outline package leadframe Specification1 ScopeThis standard specifies the semiconductor integrated circuit small outline package (SOP) of the lead frame (hereinafter referred to as the lead frame) of technical requirements and test rule. This standard is applicable to a semiconductor integrated circuit small outline package stamped leadframe.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 2423.60-2008 Environmental testing for electric and electronic products Part 2. Test methods - Test U. Robustness of terminations and integral security Attachments strength GB/T 2828.1-2012 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch test sample plan GB/T 7092 semiconductor integrated circuit Dimensions GB/T 14112-2015 semiconductor integrated circuit packaging plastic dual-stamped leadframe specification GB/T 14113 semiconductor integrated circuit package terminology SJ20129 metal plating layer thickness measurement method3 Terms and DefinitionsTerms and definitions GB/T 14112-2015 and GB/T 14113 apply as defined in this document. 4. Technical Requirements 4.1 leadframe size Lead frame dimensions should be consistent with the relevant provisions of GB/T 7092, and to comply with the lead frame design. 4.2 leadframe shape and position tolerances 4.2.1 scoliosis Scoliosis over the entire length of no more than a nominal 0.05mm. 4.2.2 curl When the thickness of the material is not more than 0.152mm, crimped 2.5 times the material thickness; when the thickness of the material is greater than 0.152mm, the crimp material 2 times the thickness. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 15878-2015_English be delivered?Answer: Upon your order, we will start to translate GB/T 15878-2015_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 15878-2015_English with my colleagues?Answer: Yes. 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