GB/T 15876-2015 English PDFUS$379.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 15876-2015: Semiconductor integrated circuits -- Specification of lead frames for plastic quad flat package Status: Valid GB/T 15876: Historical versions
Basic dataStandard ID: GB/T 15876-2015 (GB/T15876-2015)Description (Translated English): Semiconductor integrated circuits -- Specification of lead frames for plastic quad flat package Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L56 Classification of International Standard: 31.200 Word Count Estimation: 18,152 Date of Issue: 2015-05-15 Date of Implementation: 2016-01-01 Older Standard (superseded by this standard): GB/T 15876-1995 Quoted Standard: GB/T 2423.60-2008; GB/T 2828.1-2012; GB/T 7092; GB/T 14112-2015; GB/T 14113; SJ 20129 Regulation (derived from): National Standard Announcement 2015 No. 15 Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This Standard specifies the semiconductor integrated circuit flat plastic sides lead the technical requirements and inspection rules package lead frame. This Standard applies to all sides of the semiconductor integrated circuit plastic stamped lead flat package type lead frame, plastic sides etched leadframe lead flat package can also refer to use. GB/T 15876-2015: Semiconductor integrated circuits -- Specification of lead frames for plastic quad flat package---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Semiconductor integrated circuits. Specification of leadframes for plastic quad flat package ICS 31.200 L56 National Standards of People's Republic of China Replacing GB/T 15876-1995 The semiconductor integrated circuit Surrounded by plastic lead frame lead flat package specification Issued on. 2015-05-15 2016-01-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released Table of ContentsIntroduction Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 4 technical requirements Dimensions of the lead frame 1 4.1 4.2 leadframe shape and position tolerances of 1 4.3 appearance of the lead frame 3 4.4 leadframe plating 3 4.5 intensity of the lead frame outer leads 3 4.6 copper peel test 3 4.7 silver peel test 3 5 Inspection Rules 4 Constituting 5.1 Inspection Lot 4 5.2 Qualification approval procedures 4 5.3 Quality conformance inspection 4 6 7 Ordering Information 7 signs, packaging, transportation and storage 7 7.1 logo and packaging 7 7.2 Transport, storage 7 Appendix A (normative) mechanical measuring lead frame 8ForewordThis standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard replaces GB/T 15876-1995 "surrounded by plastic lead frame lead flat package specification." This standard and GB/T 15876-1995 compared to the main changes are as follows. --- According to the standard range, the standard name of the original standard was revised to "lead a semiconductor integrated circuit is surrounded by a plastic flat package Leadframe norms "; --- Normative references. increase the introductory phrase; sampling standards set by GB/T 2828.1-2012 instead of SJ/Z9007-87; increase lead With document GB/T 2423.60-2008, SJ20129; --- 4.1 standard from "Design" to "lead frame size", and the original standard wire bonding zone width, the depth and precision metal Related Content gap was adjusted to 4.2; --- Of the standard "4.2 leadframe shape and position tolerances" in the corresponding provisions of the order have been adjusted, and increases the chip bonding area Subsidence related requirements; --- Revised standard on the "curl" requirements (see 4.2.2). the original standard specifies only texturized less than 0.51mm, this standard Carried out according to a predetermined thickness of the material, respectively; --- Revised standard on the "horizontal bend" requirements (see 4.2.3). the original standard specifies only the number of leads 52 ~ 100,132 ~ 164,196 ~ 244 within three horizontal bend value range, expanding the scope of this standard covers the number of leads; --- Revised standard on the "strip twisted" requirements (see 4.2.4). the original standard only provides a framework twist of not more than 0.51mm, This standard will be revised to frame twist twisted strips, and were based on a predetermined thickness of the material; --- Revised standard on the "twisted wire" requirements (see 4.2.5). the original standard specifies the lead angle and twisted lead width The maximum offset this standard removed the lead predetermined maximum width offset; --- Revised standard on the "depth coined" requirements (see 4.2.6). Standard on original coining coining width to depth is not considered, Jane Single predetermined size range coining depth. This standard is revised as follows. ensuring the coining width not less than 90% lead width of the strip Under parts, coining depth of no more than 30% of the thickness of the material, its reference value 0.015mm ~ 0.06mm; --- The "metal gap" to "insulation gap" and revised the standard for "insulating gap" requirements (see 4.2.7). The original standard gauge Given "the gap between metals shall be subject to the limits for metals clearance on each side projecting pressure does not exceed the maximum fine 0.051mm", this standard Quasi changed to "nip spacing interval and the fine end of the chip bonding interval between two adjacent fine nip between the endpoints is greater than 0.076mm"; --- Revised standard on the "coining lead terminal coplanarity" requirements (see 4.2.8). the tolerance range specified in the standard as the original ± 0.15mm, ± 0.2mm, this standard taking into account the limiting case of a negative difference to -0.1mm; --- Revised standard on the "die attach area slope" requirements (see 4.2.9). the original standard were provided for in the fight and did not play the concave recess Maximum slope member under the provisions of the standard uniform for the maximum inclination in the length or width of each size 2.54mm 0.05mm; --- The "chip bonding area flatness" to "flatness chip bonding area" and revised the standard for "chip bonding area with flat-degree" Requirements (see 4.2.11). the abolition of the restrictions in the original standard 2.54mm chip bonding area per length; --- Revised standard on the "glitch" requirements (see 4.3.1). the original standards set forth in the vertical and horizontal burr burr no more than 0.025mm, this standard vertical and horizontal burr burr were provisions; --- Revised standard on the "pits, dents and scratches" requirements (see 4.3.2). increases in raw scratches on the basis of criteria relating to Claim; --- Revised standard on the "local silver layer thickness" requirements (see 4.4.1). the original standard specifies only a partial thickness of the silver layer, this Standard on the local silver layer thickness and any point were provisions; --- Added "copper peel test," the relevant requirements (see 4.6); --- Added "Silver peeling test" the relevant requirements (see 4.7); --- Standard "5 Inspection Rules" in the corresponding modification of terms, referring to GB/T 14112-2015 inspection rules, and adds identification Services for approval procedures and quality conformance testing; --- Amend the relevant requirements of the standard for "storage". the original standard plated shelf life of three months, the provisions of this standard is 6 months (See 7.2); --- Increasing the normative Appendix A "lead frame mechanical measurements." Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents. The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard by the National Standardization Technical Committee of the semiconductor device (SAC/TC78) centralized. This standard was drafted. Xiamen Yonghong Technology Limited. The main drafters of this standard. Lingui Xian, Chen Zhongxian, Hong Yuyun. This standard replaces the standards previously issued as follows. --- GB/T 15876-1995. The semiconductor integrated circuit Surrounded by plastic lead frame lead flat package specification1 ScopeThis standard specifies the semiconductor integrated circuit is surrounded by a plastic lead frame lead flat package (hereinafter referred to as the lead frame) and the technical requirements Inspection rules. This standard applies to the semiconductor integrated circuit is surrounded by a plastic lead flat package stamped leadframe. Four lead plastic flat package engraved Erosion can also refer to the use of the lead frame.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 2423.60-2008 Environmental testing for electric and electronic products Part 2. Test methods - Test U. Robustness of terminations and integral security Attachments strength GB/T 2828.1-2012 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch test sample plan GB/T 7092 semiconductor integrated circuit Dimensions GB/T 14112-2015 semiconductor integrated circuit packaging plastic dual-stamped leadframe specification GB/T 14113 semiconductor integrated circuit package terminology SJ20129 metal plating layer thickness measurement method3 Terms and DefinitionsTerms and definitions GB/T 14112-2015 and GB/T 14113 apply as defined in this document. 4. Technical Requirements Size 4.1 leadframe Lead frame size should be consistent with the relevant provisions of GB/T 7092, and to meet the requirements of the lead frame design drawings. 4.2 leadframe shape and position tolerances 4.2.1 scoliosis Scoliosis over the entire length of no more than a nominal 0.05mm, test method according to GB/T 14112-2015 Appendix A of. 4.2.2 curl When the thickness of the material is not more than 0.152mm, crimped 2.5 times the material thickness; when the thickness of the material is greater than 0.152mm, the crimp material 2 times the thickness of the test method according to GB/T 14112-2015 provisions of Appendix A of. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 15876-2015_English be delivered?Answer: Upon your order, we will start to translate GB/T 15876-2015_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. 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Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.Question 5: Should I purchase the latest version GB/T 15876-2015?Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 15876-2015 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically. |
