| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | See Detail | Status | Related Standard |
| SJ 21454-2018 | English | 299 |
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Days<=3
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(Integrated circuit ceramic package silicon aluminum wire bonding technology technical requirements)
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SJ 21454-2018
| Valid |
SJ 21454-2018
|