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GB/T 6346.1-2024: Fixed capacitors for use in electronic equipment - Part 1: Generic specification
Status: Valid GB/T 6346.1: Evolution and historical versions
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Fixed capacitors for use in electronic equipment - Part 1: Generic specification
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GB/T 6346.1-2024
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| GB/T 6346-1986 | English | 719 |
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Fixed capacitors for use in electronic equipment--Part 11: Sectional specification: Fixed polyethylene-terephthalate film dielectric metal foil D. C capacitors
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GB/T 6346-1986
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Basic data | Standard ID | GB/T 6346.1-2024 (GB/T6346.1-2024) | | Description (Translated English) | Fixed capacitors for use in electronic equipment - Part 1: Generic specification | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L11 | | Classification of International Standard | 31.060.10 | | Word Count Estimation | 74,733 | | Date of Issue | 2024-03-15 | | Date of Implementation | 2024-03-15 | | Older Standard (superseded by this standard) | GB/T 2693-2001 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 6346.1-2024: Fixed capacitors for use in electronic equipment - Part 1: Generic specification---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.060.10
CCSL11
National Standards of People's Republic of China
Replace GB/T 2693-2001
Fixed capacitors for electronic equipment
Part 1.General specifications
(IEC 60384-1.2021, IDT)
Released on 2024-03-15
2024-03-15 implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of Contents
Preface III
Introduction VI
1 Scope 1
2 Normative references 1
3 Terms and definitions 3
4 General requirements 7
4.1 Symbols, units and abbreviations 7
4.2 Priority values and additional technical requirements 8
4.3 Sign 10
5 General provisions for test and measurement procedures 10
5.1 General 10
5.2 Standard atmospheric conditions 10
5.3 Drying 11
5.4 Storage 12
5.5 Mounting (for surface mount capacitors only) 12
6 Electrical tests and measurements 15
6.1 Insulation resistance 15
6.2 Withstand voltage 17
6.3 Capacitance 20
6.4 Loss Tangent and Equivalent Series Resistance (ESR) 20
6.5 Leakage Current 21
6.6 Impedance 22
6.7 Self-resonant frequency and inductance 22
6.8 Capacitance Variation with Temperature 25
6.9 Surge 27
6.10 High surge current test 29
6.11 Charging and discharging test and surge current test 30
6.12 Dielectric absorption 31
6.13 Voltage transient overload (for non-solid electrolyte aluminum electrolytic capacitors) 32
7 Mechanical testing and measurements 34
7.1 Appearance and Dimension Inspection 34
7.2 Outer foil lead 35
7.3 Terminal Strength 35
7.4 Vibration 36
7.5 Collision (repeated impact) 37
7.6 Impact 37
7.7 Shear test 38
7.8 Substrate bending test 38
7.9 Housing seal 38
8 Environmental and climate tests 38
8.1 Rapid temperature changes 38
8.2 Climate sequence 39
8.3 Constant damp heat 40
8.4 Constant damp heat with applied voltage (for metallized film capacitors only) 40
8.5 Durability 41
8.6 Thermal stability test 42
8.7 High and Low Temperature Characteristics 42
8.8 Accelerated Constant Moist Heat 43
8.9 Accelerated Steady State Damp Heat (For Multilayer Ceramic Capacitors Only) 43
9 Tests related to component assembly 44
9.1 Resistance to welding heat 44
9.2 Solderability 44
9.3 Whisker growth test 45
9.4 Component resistance to solvents 46
9.5 Marking solvent resistance 46
10 Safety-related tests47
10.1 Flame retardancy 47
10.2 Pressure relief (for aluminum electrolytic capacitors) 47
11 Quality Assessment Procedure 48
Appendix A (Informative) Capacitor Pulse Test Guide 49
Appendix Q (Informative) Quality Assessment Procedure 52
Appendix X (Informative) Comparison of the structure numbers of this document with those of the previous version 60
References 62
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
This document is Part 1 of GB/T 6346 "Fixed capacitors for electronic equipment". GB/T 6346 has been published in the following parts.
--- Part 1.General specification;
--- Part 2.Sectional specification for metallized polyethylene terephthalate film dielectric DC fixed capacitors;
--- Part 2-1.Blank detail specification for evaluation of metallized polyethylene terephthalate film dielectric DC fixed capacitors
Level E and EZ;
--- Part 3.Sectional specification for surface mount MnO2 solid electrolyte tantalum fixed capacitors;
--- Part 3-1.Blank detail specification for surface mount MnO2 solid electrolyte tantalum fixed capacitors, assessment level EZ;
--- Part 4.Sectional specification for solid and non-solid electrolyte aluminium capacitors;
--- Part 4-1.Blank detail specification for non-solid electrolyte aluminium capacitors, assessment level E;
--- Part 5.Sectional specification for selection and test methods for DC mica dielectric fixed capacitors with rated voltage not exceeding 3 000 V
General requirements;
--- Part 5-1.Blank detail specification for evaluation of DC mica dielectric fixed capacitors with rated voltage not exceeding 3000 V
Level E;
--- Part 6.Sectional specification for metallized polycarbonate film dielectric DC fixed capacitors;
--- Part 6-1.Blank detail specification for metallized polycarbonate film dielectric DC fixed capacitors, assessment level E;
--- Part 7.Sectional specification for metal foil polystyrene film dielectric DC fixed capacitors;
--- Part 7-1.Blank detail specification Metal foil polystyrene film dielectric DC fixed capacitors Assessment level E;
--- Part 8.Sectional specification for Class 1 ceramic fixed capacitors;
--- Part 8-1.Blank detail specification Class 1 ceramic fixed capacitors Assessment level EZ;
--- Part 9.Class 2 ceramic fixed capacitors;
--- Part 9-1.Blank detail specification Class 2 ceramic fixed capacitors Assessment level EZ;
--- Part 11.Sectional specification for metal foil polyethylene terephthalate film dielectric DC fixed capacitors;
--- Part 11-1.Blank detail specification for evaluation of metal foil polyethylene terephthalate film dielectric DC fixed capacitors
Horizontal EZ;
--- Part 13.Sectional specification for metal foil polypropylene film dielectric DC fixed capacitors;
--- Part 13-1.Blank detail specification for metal foil polypropylene film dielectric DC fixed capacitors for assessment levels E and EZ;
--- Part 14.Sectional specification for fixed capacitors for electromagnetic interference suppression in power supplies;
--- Part 14-1.Blank detail specification for fixed capacitors for suppression of electromagnetic interference in power supplies, assessment level DZ;
--- Part 15.Sectional specification for fixed tantalum capacitors with non-solid or solid electrolytes;
--- Part 15-1.Blank detail specification for solid electrolyte foil electrodes tantalum fixed capacitors assessment level E;
--- Part 15-2.Blank detail specification for solid electrolyte sintered tantalum fixed capacitors Assessment level E;
--- Part 15-3.Blank detail specification for solid electrolyte and porous anode tantalum fixed capacitors assessment level E;
--- Part 16.Sectional specification for metallized polypropylene film dielectric DC fixed capacitors;
--- Part 16-1.Blank detail specification for metallized polypropylene film dielectric DC fixed capacitors for assessment levels E and EZ;
--- Part 17.Sectional specification for metallized polypropylene film dielectric AC and pulse fixed capacitors;
--- Part 17-1.Blank detail specification Metallized polypropylene film dielectric AC and pulse fixed capacitors Assessment level E
and EZ;
--- Part 18.Sectional specification for solid (MnO2) and non-solid electrolyte aluminium chip fixed capacitors;
--- Part 18-1.Blank detail specification for surface mount solid (MnO2) electrolyte aluminium fixed capacitors assessment level EZ;
--- Part 18-2.Blank detail specification for non-solid electrolyte aluminum chip fixed capacitors Assessment level E;
--- Part 19.Sectional specification for surface mount metallized polyethylene terephthalate film dielectric DC fixed capacitors;
--- Part 19-1.Blank detail specification for surface mount metallized polyethylene terephthalate film dielectric DC fixed capacitors
Device assessment level EZ;
--- Part 21.Sectional specification for surface mount type 1 multilayer ceramic fixed capacitors;
--- Part 21-1.Blank detail specification for surface mount type 1 multilayer ceramic fixed capacitors, assessment level EZ;
--- Part 22.Sectional specification for surface mount multilayer class 2 multilayer ceramic fixed capacitors;
--- Part 22-1.Blank detail specification for surface mount type 2 multilayer ceramic fixed capacitors, assessment level EZ;
--- Part 23.Sectional specification for surface mounted metallized polyethylene naphthalate film dielectric DC fixed capacitors;
--- Part 23-1.Blank detail specification for surface mount metallized polyethylene naphthalate film dielectric DC fixed capacitors
Assessment level EZ;
--- Part 24.Sectional specification for surface mount conductive polymer solid electrolyte tantalum fixed capacitors;
--- Part 25.Sectional specification for surface mounted conductive polymer solid electrolyte aluminium fixed capacitors;
--- Part 25-1.Blank detail specification for surface mounted conductive polymer solid electrolyte aluminium fixed capacitors, assessment level EZ;
--- Part 26.Sectional specification for conductive polymer solid electrolyte aluminium fixed capacitors;
--- Part 26-1.Blank detail specification Conductive polymer solid electrolyte aluminium fixed capacitors assessment level EZ.
This document replaces GB/T 2693-2001 "Fixed capacitors for electronic equipment Part 1.General specification".
Compared with GB/T 2693-2001, in addition to structural adjustments and editorial changes, the main technical changes are as follows.
a) The terms “capacitance variation with temperature” and “combustibility” have been deleted (see 2.2.30 and 2.2.43 of the.2001 edition);
b) The definition of the term "visible damage" has been changed (see 3.42, 2.2.34 of the.2001 edition);
c) Added letter symbols and abbreviations (see 4.1.2, 4.1.3);
d) Added the priority value of rated voltage (see 4.2.3);
e) Separate the expression methods and terms of rated AC load and rated pulse load and include them in the newly added 4.2.4 and 4.2.5 respectively (see
4.2.4, 4.2.5);
f) Added temperature derating voltage curve (see 4.2.6);
g) Added the definition of recovery (see 5.2.2);
h) Added high temperature test. "The test sample can be placed in the test chamber at any temperature from the laboratory temperature to the upper category temperature"
"(see 5.4.1.2, 8.2.3);
i) Added the low temperature storage specification. "The test sample can be placed in the test chamber at any temperature from laboratory temperature to -40°C."
Determination (see 5.4.2.2);
j) Added the requirement of “0.8mm±0.10mm thick” for substrate materials of epoxy resin glass cloth laminated printed boards (see 5.5.1);
k) The provision of "the welding operation shall be repeated once more (twice in total)" in the installation test has been deleted (see 4.33.2 of the.2001 edition);
l) Added the requirement for reflow lead-free solder. "Preformed or paste lead-free solder should contain Sn96.5Ag3.0Cu0.5 or derivatives
Solders and fluxes as specified in IEC 60068-2-58 or defined in relevant specifications. "(See 5.5.3);
m) Added withstand voltage test. "Repeated withstand voltage test may cause permanent damage to the capacitor and should be avoided as much as possible"
provisions (see 6.2.3.1);
n) Changed the description of the leakage current test circuit from "When the relevant specifications specify, a 1000Ω
"When there is no provision in the relevant specifications, the protective resistor connected in series with the capacitor should be
A 1000Ω resistor with an allowable deviation of ±10%. "(See 6.5.5, 4.9.5 of the.2001 edition);
o) The condition d) specified in the leakage current test specification has been changed from "whether it is necessary to connect a 1000Ω resistor in series according to 4.9.5" to "whether it is necessary to connect a 1000Ω resistor in series according to 4.9.5"
protection resistor to limit the charging current." is changed to "Whether a protection resistor should be connected in series with the capacitor to limit the charging current according to 6.5.5
Control charging current; if not 1000Ω, its nominal resistance value. "[see 6.5.6d), 4.9.6d of the.2001 edition)];
p) The following provisions for the capacitance variation with temperature test are added (see 6.8.1.2).
"When this test is referenced, the relevant specification shall state.
● Soaking time at each temperature;
● The time point at which the capacitance value should be measured;
● The number of loops to execute. ”
q) Added the torque values for the nominal thread diameters of 8mm, 10mm and 12mm for the terminal strength test Ud (see 7.3.5);
r) Added the preferred test conditions for collision (repeated impact) test (see 7.5.2);
s) Changed the shear test conditions. "applied force of 5N" to "unless otherwise specified in the relevant specifications, this force should be from 1N,
2N, 5N or 10N. " (see 7.7.1, 4.34.2 of the.2001 edition);
t) Added low temperature test. "The test sample can be placed in the test chamber at any temperature from the laboratory temperature to the lower limit category temperature
"(see 8.2.5);
u) Added the constant humidity test. "Unless otherwise specified in the relevant specifications, the test temperature and relative humidity shall be (40±2)℃, (93±
3)%. "For metallized film capacitors, this test should be carried out in accordance with the provisions of 8.4." (see 8.3.2);
v) Added the constant humidity test and accelerated constant humidity test. "If in the case of testing metallized film capacitors, when the blank detailed specification
When specified in the specification, the difference between the average capacitance of the test group with applied voltage and the average capacitance of the test group without applied voltage shall be
The allowable deviation shall be specified in the relevant detailed specifications. "(see 8.3.3, 8.8.4);
w) Added a constant voltage damp heat test (only for metallized film capacitors) (see 8.4);
x) Added the provisions for accelerated steady-state damp heat test for film capacitors (see 8.8);
y) Added the wet weighing test method (see 9.2);
z) Added whisker growth test (see 9.3);
aa) The quality assessment procedure has been changed and the sampling plan reference has been changed from IEC 60410 to IEC 61193-2 (see Chapter 11,
Appendix Q, Chapter 3 of the.2001 edition);
bb) The normative appendix "Appendix A Explanation of the use of sampling plans and procedures specified in IEC 60410 in quality assessment systems" has been deleted.
(See Appendix A of the.2001 edition).
This document is equivalent to IEC 60384-1.2021 "Fixed capacitors for use in electronic equipment - Part 1.General specification".
The following minimal editorial changes were made to this document.
--- "Protection resistor" in 6.5.5 is changed to "protection resistor connected in series with the capacitor";
--- Changed the informative Appendix X to compare the structure number of this document with GB/T 2693-2001;
--- Changed the list of references.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This document is under the jurisdiction of the National Technical Committee for Standardization of Resistor and Capacitor Components for Electronic Equipment (SAC/TC165).
This document was drafted by. Xiamen Fara Electronics Co., Ltd., China Electronics Technology Standardization Institute, Hunan Aihua Group Co., Ltd.
Co., Ltd., Xiamen Teju Technology Co., Ltd., and Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences.
The main drafters of this document are. Huang Shunda, Lin Jintao, Liu Xuekong, Lan Shaohan, Huang Yuanbin, Chen Yuanqiang and Lin Junhong.
The previous versions of the documents replaced by this document are as follows.
---First published as GB/T 2693-1986 in 1986, first revised in.1990, second revised in.2001;
Introduction
Fixed capacitors for electronic equipment are basic components widely used in the electronic information industry. The development of this series of documents can guide the industry to
More effectively solve the product quality evaluation problem of fixed capacitors used in electronic equipment.
There are many categories or models of fixed capacitors for electronic equipment. The corresponding IEC 60384 series documents are divided into different parts.
The writing method is consistent with that of IEC standards. In addition, the technical requirements for fixed capacitors of different categories or models are also different.
The different parts are compiled.
GB/T 6346 "Fixed Capacitors" series of documents consists of general specifications, sub-specifications, blank detailed specifications, detailed specification hierarchical system documents.
See Figure 1.GB/T 6346 "Fixed Capacitors" series of documents is planned to consist of the following 48 parts (current GB/T 6346 composition documents
See the preface for details).
--- Part 1.General specification. The purpose is to determine the most common items of fixed capacitors for electronic equipment.
Language, inspection procedures and test methods.
--- Part 2 to Part 26.Sectional specifications. Sectional specifications are subordinate specifications of the general specification. Their purpose is to determine the requirements that require individual provisions.
Terms and definitions, preferred ratings and characteristics of fixed capacitors for specific classes or types, and selection of applicable ones from the general specification
Quality assessment procedures, test and measurement methods and additional details, as well as giving general performance requirements. These items are usually dimensions and
Priority values of properties, additional test methods and relevant provisions of the test methods given in the general specification, requirements for sampling and specimen preparation,
Recommended test severity levels and preferred acceptance criteria. The sectional specification also defines the test list used in all lower-level detailed specifications.
The structure and scope of the table.
--- Part 2-1 to Part 26-1.Blank detail specifications. The purpose is to identify the characteristics of different assessment levels that need to be specified individually.
The detailed specification format, layout and minimum content requirements for fixed capacitors of certain categories or models provide specification writers with
A guide for the preparation of detailed specifications that meet the requirements of the upper-level general specifications or sub-specifications. It is used to ensure the uniformity of detailed specifications.
Regulation.
---Detailed specification. The purpose is to determine all the information required for a given model and range of fixed capacitors, including all specifications and dimensions.
The requirements for the size and characteristic values of fixed capacitors are also given in the appropriate quality assessment system.
All the information required for the determination of the test severity level and acceptance criteria for all applications and a complete test schedule.
Detailed specifications can be either specifications within the national standard system or industry specifications related to the national standard system, or
It is a specification established by the manufacturer or user.
General Specifications
This general specification covers most of the common items in the category of fixed capacitors for electronic equipment, such as terminology, measurement and test methods.
The item needs to specify the conditions or parameter characteristics of a specific category or model of fixed capacitors. Such a specification requires a subsidiary under the lower level
The specifications are given.
For the range of fixed capacitors, the number reference for the general specification is GB/T 6346.1/IEC 60384-1.
Sub-specifications
The sectional specifications cover the supplement of all items given in the general specification, these are details of a specific grouping of fixed capacitors.
The objectives are usually the preferred values of dimensions and properties, additional test methods and relevant provisions for test methods given in the general specification, sampling and specimen preparation.
The specification also outlines the test schedules used in all lower level detailed specifications.
structure and scope.
For the range of fixed capacitors, the sub-specification numbers are referenced from GB/T 6346.2/IEC 60384-2 (current document number is
GB/T 7332/IEC 60384-2) Polyester film capacitors to the current GB/T 6346.26/IEC 60384-26 Conductive polymer solid electrolyte
High quality aluminum electrolytic capacitors. The diversity of sub-specifications can accommodate fixed capacitors with different technical combinations.
Detailed specifications
The detailed specification provides, either directly or by reference to other specifications, all that is needed to fully describe a given model and range of fixed capacitors.
They also give the types of fixed capacitors covered within the appropriate quality assessment system.
All information required for the qualification of the test unit and scope, including all applicable test severity levels and acceptance criteria requirements and complete test
Test list.
Detailed specifications can be either specifications within the national standard system or another specification system related to the national standard system.
specifications within the product, or specifications established by the manufacturer or user.
For the scope of fixed capacitors, for example, if the relevant sectional specification is GB/T 6346.3/IEC 60384-3 and the supplementary blank details
If the standard is GB/T 6346.301/IEC 60384-3-1, the number reference of the detailed specification is GB/T 6346.30101/IEC 60384-3-101.
Blank detail specification
A hierarchical system of specifications, where one or more blank detail specifications supplement a sub-specification, is used to ensure uniformity of the detail specifications.
Regulation.
The blank detail specification provides the specification writer with a template for the layout and content to be presented and for compliance with the upper-level general specification.
Guidelines for the preparation of detailed specifications required by a standard or sub-specification.
Blank detail specifications are not considered to be related specifications since they do not themselves define any particular component.
The existing hierarchical specification system with blank detail specifications allows the development of detailed specifications even outside the relevant national standards technical committee.
Detailed specifications.
For the scope of fixed capacitors, for example, if the relevant sectional specification is GB/T 6346.3/IEC 60384-3, then the blank detailed specification
The reference number is GB/T 6346.301/IEC 60384-3-1.
Related specifications
Within this system, the term "related specification" refers, where applicable, to the lower-level specification that contains the specific requirements.
Any general specification or sub-specification may be referred to in an abstract and general manner at any level below using the expression "related specifications".
specification.
Index number description.
1---When applicable, indicate the scope of the "related specifications" for the upper-level general specifications;
2---When applicable, indicate the scope of the "related specifications" for the upper-level sub-specifications.
Figure 1 Standard system for fixed capacitors
Fixed capacitors for electronic equipment
Part 1.General specifications
1 Scope
This document specifies standard terminology used in sectional and detail specifications of electronic components for use in the assessment of quality or for any other purpose.
Inspection procedures and test methods.
This document applies to fixed capacitors for use in electronic equipment.
2 Normative references
The contents of the following documents constitute the essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 2421-2020 Overview and Guidelines for Environmental Testing (IEC 60068-1.2013, IDT)
Note. GB/T 321-2005 Priority numbers and priority number systems (IS03.1973, IDT)
Note. GB/T 2691-2016 Marking code for resistors and capacitors (IEC 60062.2004, IDT)
Note. GB/T 2471-2024 Resistors and capacitors priority number system (IEC 60063.2015, IDT)
Tests-TestsA.Cold)
Note. GB/T 2423.1-2008 Environmental testing for electric and electronic products Part 2.Test methods Test A. Low temperature (IEC 60068-2-1.2007, IDT)
Tests-Test B.Dry heat)
Note. GB/T 2423.2-2008 Environmental testing for electric and electronic products Part 2.Test methods Test B. High temperature (IEC 60068-2-2.2007, IDT)
IEC 60068-2-6 Environmental testing Part 2-6.Test methods Test Fc. Vibration (sinusoidal)
Note. GB/T 2423.10-2019 Environmental testing Part 2.Test methods Test Fc. Vibration (sinusoidal) (IEC 60068-2-6.2007, IDT)
Part 2-13.Tests-TestM. Low air pressure)
Note. GB/T 2423.21-2008 Environmental testing for electric and electronic products Part 2.Test methods Test M. Low pressure (IEC 60068-2-13.
1983,IDT)
Part 2-14.Tests-Test N. Change of temperature)
Note. GB/T 2423.22-2012 Environmental testing Part 2.Test method Test N. Temperature change (IEC 60068-2-14.2009, IDT)
IEC 60068-2-17 Basic environmental testing procedures Part 2-17.Test methods Test Q. Sealing (Basicenvironmental
Note. GB/T 2423.23-2013 Environmental testing Part 2.Test methods Test Q. Sealing (IEC 60068-2-17.1994, IDT)
IEC 60068-2-20 Environmental testing Part 2-20.Tests Ta and Tb. Solderability and resistance of components with leads
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