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GB/T 42835-2023: Semiconductor integrated circuits - System on chip(SoC)
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 42835-2023 | English | 269 |
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Semiconductor integrated circuits - System on chip(SoC)
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GB/T 42835-2023
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Basic data | Standard ID | GB/T 42835-2023 (GB/T42835-2023) | | Description (Translated English) | Semiconductor integrated circuits - System on chip(SoC) | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L56 | | Classification of International Standard | 31.200 | | Word Count Estimation | 14,199 | | Date of Issue | 2023-08-06 | | Date of Implementation | 2023-12-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 42835-2023: Semiconductor integrated circuits - System on chip(SoC)---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200
CCSL56
National Standards of People's Republic of China
Semiconductor integrated circuit system-on-chip (SoC)
Published on 2023-08-06
Implemented on 2023-12-01
State Administration for Market Regulation
Released by the National Standardization Administration Committee
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents"
Drafting.
Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents.
This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This document was drafted by. China Electronics Technology Standardization Institute, Beijing Zhixin Microelectronics Technology Co., Ltd., Beijing Xinkejian Technology Co., Ltd.
Co., Ltd., Hangzhou Van High-tech Co., Ltd.
The main drafters of this document. Luo Xiaoyu, Xu Pingjiang, Zhong Mingchen, Zhao Yang, Shao Jin, Chen Yanning, Zhu Songchao, Wang Yubo, Zhang Haifeng, Liang Luhui,
Xia Junhu, He Jie.
Semiconductor integrated circuit system-on-chip (SoC)
1 Scope
This document specifies the technical requirements, electrical test methods and inspection rules for systems on a chip (SoC).
This document applies to the design, manufacturing, procurement, and acceptance of system-on-chip (SoC).
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations
For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to
this document.
GB/T 191 Packaging, storage and transportation pictorial mark
GB/T 4937.3 Mechanical and climatic test methods for semiconductor devices Part 3.External visual inspection
GB/T 4937.4 Mechanical and climatic test methods for semiconductor devices Part 4.Highly accelerated steady-state hot and humid test (HAST)
GB/T 4937.11 Mechanical and climatic test methods for semiconductor devices Part 11.Rapid temperature change double liquid tank method
GB/T 4937.13 Mechanical and climatic test methods for semiconductor devices Part 13.Salt spray
GB/T 4937.14 Mechanical and climatic test methods for semiconductor devices Part 14.Terminal strength (lead robustness)
GB/T 4937.15 Mechanical and climatic test methods for semiconductor devices Part 15.Soldering heat resistance of through-hole mounted devices
GB/T 4937.21 Mechanical and climatic test methods for semiconductor devices Part 21.Solderability
GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23.High temperature operating life
GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26.Electrostatic discharge (ESD) sensitivity tester
Body model (HBM)
GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27.Electrostatic discharge (ESD) sensitivity testing machine
Machine Model (MM)
GB/T 9178 Integrated circuit terminology
GB/T 12750 Semiconductor device integrated circuits Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits)
GB/T 17574-1998 Semiconductor devices integrated circuits Part 2.Digital integrated circuits
GB/T 17626.2-2018 Electromagnetic compatibility testing and measurement technology electrostatic discharge immunity test
GB/T 17626.4-2018 Electromagnetic compatibility test and measurement technology Electrical fast transient burst immunity test
IEC 60749-9 Mechanical and climatic test methods for semiconductor devices Part 9.Marking durability (Semiconductor
IEC 60749-24 Mechanical and climatic test methods for semiconductor devices Part 24.Accelerated moisture resistance - unbiased strongly accelerated stress test
sistance-UnbiasedHAST)
IEC 60749-28 Mechanical and climatic test methods for semiconductor devices Part 28.Electrostatic discharge (ESD) susceptibility test strips
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