Search result: GB/T 17473.7-2022 (GB/T 17473.7-2008 Older version)
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| GB/T 17473.7-2022 | English | 139 |
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Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance
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GB/T 17473.7-2022
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| GB/T 17473.7-2008 | English | 70 |
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Test methods of precious metals pastes used for microelectronics -- Determination of solderability and solderelaching resistance
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GB/T 17473.7-2008
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| GB/T 17473.7-1998 | English | 239 |
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Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance
| Obsolete |
GB/T 17473.7-1998
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| Standard ID | GB/T 17473.7-2022 (GB/T17473.7-2022) | | Description (Translated English) | Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H23 | | Classification of International Standard | 77.040.99 | | Word Count Estimation | 7,767 | | Date of Issue | 2022-03-09 | | Date of Implementation | 2022-10-01 | | Drafting Organization | Guiyan Platinum Industry Co., Ltd., Nonferrous Metal Technology and Economic Research Institute Co., Ltd. | | Administrative Organization | National Nonferrous Metals Standardization Technical Committee (SAC/TC 243) | | Proposing organization | China Nonferrous Metals Industry Association | | Issuing agency(ies) | State Administration for Market Regulation, National Standardization Administration |
GB/T 17473.7-2022
Test methods of precious metals pastes used for microelectronics - Part 7.Determination of solderability and solder leaching resistance
ICS 77.040.99
CCSH23
National Standards of People's Republic of China
Replacing GB/T 17473.7-2008
Test method for precious metal pastes used in microelectronics
Part 7.Determination of solderability and resistance to soldering
Published on 2022-03-09
2022-10-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration
foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents"
drafted.
This document is part 7 of GB/T 17473 "Test Methods for Precious Metal Pastes for Microelectronics". GB/T 17473 has been released
the following parts.
--- Part 1.Determination of solid content;
--- Part 2.Determination of fineness;
--- Part 3.Determination of square resistance;
--- Part 4.Adhesion test;
--- Part 5.Determination of viscosity;
--- Part 6.Resolution determination;
--- Part 7.Determination of solderability and solder resistance.
This document replaces GB/T 17473.7-2008 "Measurement of Solderability and Solder Resistance of Precious Metal Pastes for Microelectronics Technology", and
Compared with GB/T 17473.7-2008, in addition to structural adjustment and editorial changes, the main technical changes are as follows.
a) Changed the regulations and requirements for the selection of substrates for testing (see 5.1, 3.1 of the.2008 edition);
b) Deleted "The maximum operating temperature is 1000℃" (see 4.2 of the.2008 edition);
c) Changed the provisions on the selection of drying equipment (see 6.4, 4.4 of the.2008 edition);
d) The regulations on the area of the paste printing pattern have been changed (see 7.2, 5.2 of the.2008 edition);
e) Changed the specification of the solder set temperature (see 8.1.2, 5.5.1 and 5.6.1 of the.2008 edition);
f) Changed the stipulation of solderability test dip soldering time (see 8.2.6, 5.5.6 of the.2008 edition);
g) Changed the stipulation of the soldering resistance test dip soldering time (see 8.3.2, 5.6.3 of the.2008 edition).
Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents.
This document is proposed by China Nonferrous Metals Industry Association.
This document is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243).
This document is drafted by. Guiyan Platinum Industry Co., Ltd., Nonferrous Metals Technology and Economic Research Institute Co., Ltd.
The main drafters of this document. Liang Shiyu, Li Wenlin, Liu Jisong, Zhu Wuxun, Xiang Lei, Tian Xiangliang, Li Jiangmin, Fan Mingna, Ma Xiaofeng.
This document was first published in.1998, and was revised for the first time in.2008.This is the second revision.
introduction
GB/T 17473 "Test Method for Precious Metal Slurry for Microelectronics Technology" is a test item of precious metal slurry for microelectronics technology
The test method standard, in order to facilitate management and use, consists of seven parts.
--- Part 1.Determination of solid content. The content of solid components in the slurry was determined according to the mass difference before and after heating.
--- Part 2.Determination of fineness. Determine the solid particles in the slurry by visual inspection according to the position of the longitudinal stripes in the grooves on the surface of the fineness meter.
the size of the thing.
--- Part 3.Determination of square resistance. It is to print the precious metal paste into a graphic of a specified size through a screen, and after curing or sintering, the measurement is carried out.
Measure the resistance of the film layer to calculate the corresponding square resistance.
--- Part 4.Adhesion test. It is to weld the copper wire vertically on the sintered precious metal slurry film layer, and place it on the tension machine at a constant speed.
It was pulled off from the substrate, and the average value of the pulling force was used to characterize the adhesion of the slurry on the substrate.
--- Part 5.Determination of viscosity. It is to rotate the test shaft of the rotational viscometer in a constant temperature slurry at a certain speed.
The torque caused by the viscous resistance was used to measure the viscosity of the slurry.
--- Part 6.Resolution determination. It is to print the precious metal paste into a graphic of a specified size through a screen, and after curing or sintering,
Observe and measure the line width and line spacing of the film pattern with a microscope to determine the resolution of the paste.
--- Part 7.Determination of solderability and solder resistance. According to the immersion of molten solder on the metal conductor film layer after paste sintering (solidification)
Saturation degree, visually determine solderability with a magnifying glass. According to the change in the area of the metal conductor film before and after etching in the molten solder, use
Solder resistance was determined visually with a magnifying glass.
Test method for precious metal pastes used in microelectronics
Part 7.Determination of solderability and resistance to soldering
Caution - Persons using this document should have practical experience in formal laboratory work. This document does not address all possible security issues
question. It is the user's responsibility to take appropriate safety and health measures and to ensure compliance with the conditions stipulated by relevant national regulations.
1 Scope
This document specifies the method for the determination of solderability and solder resistance of precious metal pastes for microelectronics technology.
This document is applicable to the determination of solderability and solder resistance of precious metal pastes used in microelectronics technology.
Non-precious metal paste solderable paste can also be used for reference.
2 Normative references
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations
documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to
this document.
GB/T 3131 Tin-lead solder
GB/T 20422 Lead-free solder
3 Terms and Definitions
There are no terms and definitions that need to be defined in this document.
4 Principles of the method
According to the degree of immersion saturation of molten solder on the metal conductor film layer after paste sintering (solidification), use a magnifying glass to visually determine whether it can be
Weldability.
According to the change of the area of the metal conductor film before and after being etched in the molten solder, its solder resistance is determined visually with a magnifying glass.
5 Materials
5.1 Substrate. select the corresponding substrate according to the actual application of the slurry, and the surface roughness of the substrate is ≤1.5μm (when the measurement distance is 10mm)
measured under conditions).
5.2 Solder. tin-lead solder S-Sn60Pb and lead-free solder Sn96.5Ag3.0Cu0.5.
The tin-lead solder S-Sn60Pb used shall meet the requirements in GB/T 3131.
The lead-free solder Sn96.5Ag3.0Cu0.5 used shall meet the requirements in GB/T 20422.
5.3 Flux. rosin alcohol solution, the mass volume concentration is 0.15g/mL~0.3g/mL.
5.4 Solder cleaning agent. absolute ethanol, analytically pure.
......
GB/T 17473.7-2008
GB
NATIONAL STANDARD OF THE
PEOPLE’S REPUBLIC OF CHINA
ICS 77.120.99
H 68
Replacing GB/T 17473.7-1998
Test methods of precious metals pastes used for
microelectronics - Determination of solderability and
solderelaching resistance [should be: solderleaching]
ISSUED ON: MARCH 31, 2008
IMPLEMENTED ON: SEPTEMBER 01, 2008
Issued by: General Administration of Quality Supervision, Inspection and
Quarantine of PRC;
Standardization Administration of PRC.
Table of Contents
Foreword ... 3
1 Scope ... 5
2 Method principle ... 5
3 Material ... 5
4 Instruments and equipment... 6
5 Measurement procedure ... 6
6 Description of measurement results ... 7
7 Test report ... 8
Foreword
This standard is an integrated revision of GB/T 17473-1998 " Test methods of
precious metal pastes used for thick film microelectronics" (all parts). It is
divided into 7 parts:
- GB/T 17473.1-2008 Test methods of precious metals pastes used for
microelectronics - Determination of solids content;
- GB/T 17473.2-2008 Test methods of precious metals pastes used for
microelectronics - Determination of fineness;
- GB/T 17473.3-2008 Test methods of precious metals pastes used for
microelectronics - Determination of sheet resistance;
- GB/T 174743.4-2008 Test methods of precious metals pastes used for
microelectronics - Determination of adhesion;
- GB/T 174743.5-2008 Test methods of pastes used for microelectronics -
Determination of viscosity;
- GB/T 174743.6-2008 Test methods of precious metal pastes used for
microelectronics - Determination of resolution;
- GB/T 174743.7-2008 Test methods of precious metals pastes used for
microelectronics - Determination of solderability and solderleaching
resistance.
This Part is Part 7 of GB/T 17473-2008.
This part replaces GB/T 17473.7-1998 "Test methods of precious metal pastes
used for thick film microelectronics - Determination of solderability and
solderleaching resistance".
Compared with GB/T 17473.7-1998, this Part mainly has the following changes:
- In the Scope, DELETE the content that "the non-precious metal weldable
pastes can also be implemented with reference to this standard";
- CHANGE the original standard name into "Test methods of precious metals
pastes used for microelectronics - Determination of solderability and
solderleaching resistance";
- CHANGE the "Thick film tunnel sintering furnace, which has a temperature
range from room temperature to 1000 °C" in the original standard into
"Thick film tunnel sintering furnace, which has a highest use temperature
of 1000 °C AND a control accuracy of ±5 °C";
Test methods of precious metals pastes used for
microelectronics - Determination of solderability and
solderleaching resistance
1 Scope
This standard specifies the method for determining the solderability and
solderleaching resistance of precious metal solder pastes, which are used in
microelectronics technology.
This standard is applicable to the determination of solderability and
solderleaching resistance of precious metal solderable pastes, which are used
in microelectronics technology.
2 Method principle
According to the degree of immersion saturation of the molten solder on the
conductor film, the solderability can be determined visually, through a
magnifying glass.
According to the change of the area, before and after the metal conductor film
is etched in the molten solder, the solderleaching resistance is determined by
visual inspection, through a magnifying glass.
3 Material
3.1 Substrate: Alumina substrate, which has a purity of not less than 95%, AND
a surface roughness of 0.5 μm ~ 1.5 μm (measured at a measuring distance of
10 mm).
3.2 Solder: HLSn60PbA or HLSn60PbB solder and lead-free solder
SnAg3.0Cu0.5.
3.3 Flux: Rosin alcohol solution, which has a mass concentration of 0.15 g/mL
~ 0.3 g/mL.
3.4 Solder cleaning agent: Ethanol.
5.5.8 Under a magnifying glass, observe the conductor film of the printed
pattern on the solder-impregnated substrate.
5.6 Solderleaching test
5.6.1 Determine the solder temperature, based on the melting temperature of
the solder.
5.6.2 The solder test is carried out, in accordance with the operating steps 5.5.1
~ 5.5.6 and 5.5.8.
5.6.3 Determine the immersion time, according to different pastes.
5.6.4 Under the magnifying glass, observe the condition of the conductor film
of the printed pattern on the substrate receiving the solder.
6 Description of measurement results
6.1 Solderability
6.1.1 When observed under a magnifying glass, if the area of the printed pattern
conductive film on the substrate, that accepts solder, is not less than 9/10 of the
pattern area, THEN the solderability is good; if it is less than 9/10, the
solderability is poor.
6.1.2 If the printed pattern on the substrate has 1/10 of the unsoldered area,
the solderability is poor.
6.1.3 If a specimen with poor weldability appears in a batch of specimens, take
the double quantity of samples for test again, to repeat the operations 5.5.1 ~
5.5.8. If there is no situation of 6.1.2 occurred on the specimen, the solderability
is good; if there is one specimen with poor solderability in the double quantity
of specimens, this batch of specimens are poor in solderability.
6.2 Solderleaching
6.2.1 When observed under a magnifying glass, if the area of the printed pattern
conductive film on the substrate, that accepts solder, is not less than 9/10 of the
pattern area, THEN the solderleaching is good; if it is less than 9/10, the
solderleaching is poor.
6.2.2 If the printed pattern on the substrate has 1/10 of the unsoldered area,
the solderleaching is poor.
6.2.3 If a specimen with poor solderleaching appears in a batch of specimens,
take the double quantity of samples for test again, to repeat the operations 5.6.1
~ 5.6.4. If there is no situation of 6.2.2 occurred on the specimen, the
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