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GB/T 17473.7-2022: Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance
Status: Valid GB/T 17473.7: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 17473.7-2022 | English | 139 |
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Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance
| Valid |
GB/T 17473.7-2022
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| GB/T 17473.7-2008 | English | 70 |
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Test methods of precious metals pastes used for microelectronics -- Determination of solderability and solderelaching resistance
| Obsolete |
GB/T 17473.7-2008
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| GB/T 17473.7-1998 | English | 239 |
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Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance
| Obsolete |
GB/T 17473.7-1998
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PDF similar to GB/T 17473.7-2022
Basic data | Standard ID | GB/T 17473.7-2022 (GB/T17473.7-2022) | | Description (Translated English) | Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H23 | | Word Count Estimation | 7,733 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 17473.7-2022: Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods of precious metals pastes used for microelectronics - Part 7.Determination of solderability and solder leaching resistance
ICS 77.040.99
CCSH23
National Standards of People's Republic of China
Replacing GB/T 17473.7-2008
Test method for precious metal pastes used in microelectronics
Part 7.Determination of solderability and resistance to soldering
Published on 2022-03-09
2022-10-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration
foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents"
drafted.
This document is part 7 of GB/T 17473 "Test Methods for Precious Metal Pastes for Microelectronics". GB/T 17473 has been released
the following parts.
--- Part 1.Determination of solid content;
--- Part 2.Determination of fineness;
--- Part 3.Determination of square resistance;
--- Part 4.Adhesion test;
--- Part 5.Determination of viscosity;
--- Part 6.Resolution determination;
--- Part 7.Determination of solderability and solder resistance.
This document replaces GB/T 17473.7-2008 "Measurement of Solderability and Solder Resistance of Precious Metal Pastes for Microelectronics Technology", and
Compared with GB/T 17473.7-2008, in addition to structural adjustment and editorial changes, the main technical changes are as follows.
a) Changed the regulations and requirements for the selection of substrates for testing (see 5.1, 3.1 of the.2008 edition);
b) Deleted "The maximum operating temperature is 1000℃" (see 4.2 of the.2008 edition);
c) Changed the provisions on the selection of drying equipment (see 6.4, 4.4 of the.2008 edition);
d) The regulations on the area of the paste printing pattern have been changed (see 7.2, 5.2 of the.2008 edition);
e) Changed the specification of the solder set temperature (see 8.1.2, 5.5.1 and 5.6.1 of the.2008 edition);
f) Changed the stipulation of solderability test dip soldering time (see 8.2.6, 5.5.6 of the.2008 edition);
g) Changed the stipulation of the soldering resistance test dip soldering time (see 8.3.2, 5.6.3 of the.2008 edition).
Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents.
This document is proposed by China Nonferrous Metals Industry Association.
This document is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243).
This document is drafted by. Guiyan Platinum Industry Co., Ltd., Nonferrous Metals Technology and Economic Research Institute Co., Ltd.
The main drafters of this document. Liang Shiyu, Li Wenlin, Liu Jisong, Zhu Wuxun, Xiang Lei, Tian Xiangliang, Li Jiangmin, Fan Mingna, Ma Xiaofeng.
This document was first published in.1998, and was revised for the first time in.2008.This is the second revision.
Introduction
GB/T 17473 "Test Method for Precious Metal Slurry for Microelectronics Technology" is a test item of precious metal slurry for microelectronics technology
The test method standard, in order to facilitate management and use, consists of seven parts.
--- Part 1.Determination of solid content. The content of solid components in the slurry was determined according to the mass difference before and after heating.
--- Part 2.Determination of fineness. Determine the solid particles in the slurry by visual inspection according to the position of the longitudinal stripes in the grooves on the surface of the fineness meter.
the size of the thing.
--- Part 3.Determination of square resistance. It is to print the precious metal paste into a graphic of a specified size through a screen, and after curing or sintering, the measurement is carried out.
Measure the resistance of the film layer to calculate the corresponding square resistance.
--- Part 4.Adhesion test. It is to weld the copper wire vertically on the sintered precious metal slurry film layer, and place it on the tension machine at a constant speed.
It was pulled off from the substrate, and the average value of the pulling force was used to characterize the adhesion of the slurry on the substrate.
--- Part 5.Determination of viscosity. It is to rotate the test shaft of the rotational viscometer in a constant temperature slurry at a certain speed.
The torque caused by the viscous resistance was used to measure the viscosity of the slurry.
--- Part 6.Resolution determination. It is to print the precious metal paste into a graphic of a specified size through a screen, and after curing or sintering,
Observe and measure the line width and line spacing of the film pattern with a microscope to determine the resolution of the paste.
--- Part 7.Determination of solderability and solder resistance. According to the immersion of molten solder on the metal conductor film layer after paste sintering (solidification)
Saturation degree, visually determine solderability with a magnifying glass. According to the change in the area of the metal conductor film before and after etching in the molten solder, use
Solder resistance was determined visually with a magnifying glass.
Test method for precious metal pastes used in microelectronics
Part 7.Determination of solderability and resistance to soldering
Caution - Persons using this document should have practical experience in formal laboratory work. This document does not address all possible security issues
question. It is the user's responsibility to take appropriate safety and health measures and to ensure compliance with the conditions stipulated by relevant national regulations.
1 Scope
This document specifies the method for the determination of solderability and solder resistance of precious metal pastes for microelectronics technology.
This document is applicable to the determination of solderability and solder resistance of precious metal pastes used in microelectronics technology.
Non-precious metal paste solderable paste can also be used for reference.
2 Normative references
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations
documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to
this document.
GB/T 3131 Tin-lead solder
GB/T 20422 Lead-free solder
3 Terms and Definitions
There are no terms and definitions that need to be defined in this document.
4 Principles of the method
According to the degree of immersion saturation of molten solder on the metal conductor film layer after paste sintering (solidification), use a magnifying glass to visually determine whether it can be
Weldability.
According to the change of the area of the metal conductor film before and after being etched in the molten solder, its solder resistance is determined visually with a magnifying glass.
5 Materials
5.1 Substrate. select the corresponding substrate according to the actual application of the slurry, and the surface roughness of the substrate is ≤1.5μm (when the measurement distance is 10mm)
measured under conditions).
5.2 Solder. tin-lead solder S-Sn60Pb and lead-free solder Sn96.5Ag3.0Cu0.5.
The tin-lead solder S-Sn60Pb used shall meet the requirements in GB/T 3131.
The lead-free solder Sn96.5Ag3.0Cu0.5 used shall meet the requirements in GB/T 20422.
5.3 Flux. rosin alcohol solution, the mass volume concentration is 0.15g/mL~0.3g/mL.
5.4 Solder cleaning agent. absolute ethanol, analytically pure.
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