GB/T 42836-2023 English PDF

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GB/T 42836-2023: Microwave semiconductor integrated circuits - Frequency mixer
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 42836-2023	569	Add to Cart	5 days	Microwave semiconductor integrated circuits - Frequency mixer	Valid

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Basic data

Standard ID: GB/T 42836-2023 (GB/T42836-2023)
Description (Translated English): Microwave semiconductor integrated circuits - Frequency mixer
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L56
Classification of International Standard: 31.200
Word Count Estimation: 30,320
Date of Issue: 2023-08-06
Date of Implementation: 2023-12-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 42836-2023: Microwave semiconductor integrated circuits - Frequency mixer

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200 CCSL56 National Standards of People's Republic of China Microwave semiconductor integrated circuit Mixer Frequencymixer Published on 2023-08-06 Implemented on 2023-12-01 State Administration for Market Regulation Released by the National Standardization Administration Committee

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This document was drafted by. China Electronics Technology Standardization Institute, Guangxun Testing (Guangdong) Co., Ltd., Anhui Simak Electric Co., Ltd. Company, Chengdu Yaguang Electronics Co., Ltd., Sanqi (Huizhou) Electronic Technology Co., Ltd., Qingdao Zhiteng Microelectronics Co., Ltd., Guangdong Lidno Electronic Technology Co., Ltd., China Electronics Technology Group Corporation 13th Research Institute, China Electronics Technology Group Corporation 55th Research Institute, China Electronics Technology Group Corporation The 38th Research Institute of China Electronics Technology Group Corporation and the 35th Research Institute of China Aerospace Science and Industry Corporation. The main drafters of this document. Zhou Jun, Huang Yongzhong, Jiang Fuqiang, Yang Xiaoyu, Liu Xin, Chen Jigan, Li Hailong, Huo Yuzhu, Zhou Shuhao, Wu Weili, Wang Bangjin, Zhao Yan, Liu Fang. Microwave semiconductor integrated circuit Mixer

1 Scope

This document stipulates the classification, technical requirements, electrical characteristics test methods and inspection rules of mixers. This document applies to the design, manufacturing, procurement and acceptance of mixers designed and manufactured using semiconductor integrated circuit processes.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 4589.1 Semiconductor devices Part 10.General specifications for discrete devices and integrated circuits GB/T 4937.3 Mechanical and climatic test methods for semiconductor devices Part 3.External visual inspection GB/T 4937.4 Mechanical and climatic test methods for semiconductor devices Part 4.Highly accelerated steady-state hot and humid test (HAST) GB/T 4937.11 Mechanical and climatic test methods for semiconductor devices Part 11.Rapid temperature change double liquid tank method GB/T 4937.13 Mechanical and climatic test methods for semiconductor devices Part 13.Salt spray GB/T 4937.14 Mechanical and climatic test methods for semiconductor devices Part 14.Terminal strength (lead robustness) GB/T 4937.15 Mechanical and climatic test methods for semiconductor devices Part 15.Soldering heat resistance of through-hole mounted devices GB/T 4937.21 Mechanical and climatic test methods for semiconductor devices Part 21.Solderability GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23.High temperature operating life GB/T 4937.24 Mechanical and climatic test methods for semiconductor devices Part 24.Accelerated moisture resistance - Unbiased HAST GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26.Electrostatic discharge (ESD) sensitivity tester Body model (HBM) GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27.Electrostatic discharge (ESD) sensitivity testing machine Machine Model (MM) GB/T 9178 Integrated circuit terminology GB/T 12750 Semiconductor device integrated circuits Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits) GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1.General principles GB/T 19403.1 Semiconductor device integrated circuits Part 11.Part 1.Internal visual inspection of semiconductor integrated circuits (excluding including hybrid circuits) QB/T 3811 plastic packing tape SJ/T 10147 Integrated circuit anti-static packaging tube SJ/T 11587 Technical requirements for anti-static packaging of electronic products IEC 60749-9 Mechanical and climatic test methods for semiconductor devices Part 9.Marking durability (Semiconductor ......

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