GB/T 26572-2011 PDF in English
GB/T 26572-2011 (GB/T26572-2011, GBT 26572-2011, GBT26572-2011)
Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Name of Chinese Standard | Status |
GB/T 26572-2011 | English | 95 |
Add to Cart
|
0-9 seconds. Auto-delivery.
|
[Including 2024XG1] Requirements of concentration limits for certain restricted substances in electrical and electronic products
| Valid |
Standards related to (historical): GB/T 26572-2011
PDF Preview
GB/T 26572-2011: PDF in English (GBT 26572-2011) GB/T 26572-2011
GB
ICS 31.020
L 10
National Standard
of the People’s Republic of China
Requirements of concentration limits for certain
restricted substances in electrical and electronic
products
ISSUED ON. MAY 12, 2011
IMPLEMENTED ON. AUGUST 1, 2008
Issued by. General Administration of Quality Supervision, Inspection and
Quarantine of the People's Republic of China;
Standardization Administration Committee.
Table of Contents
Foreword ... 3
Introduction ... 4
1 Scope ... 5
2 Normative references ... 5
3 Terms and definitions ... 5
4 Requirements for concentration limits ... 6
5 Test methods ... 6
6 Compliance determination rules... 7
Annex A ... 8
A.1 Structure of electrical and electronic products ... 8
A.2 Prepare and requirements of disassembly ... 8
A.3 Disassembly objectives and disassembly principles of electrical and
electronic products ... 10
Annex B ... 12
B.1 Disassembly example of circuit board assembly ... 12
B.2 Disassembly example of the integrated circuit with pins ... 12
B.3 Disassembly example of array-category integrated circuit ... 13
B.4 Disassembly example of printed circuit board ... 13
B.5 Disassembly example of pin-free rectangular chip components ... 14
Annex C ... 16
C.1 Introduction ... 16
C.2 XRF analytical instruments ... 16
C.3 Factors that affect the results of XRF analysis ... 17
C.4 XRF screening examples ... 18
Annex D ... 26
References ... 29
Foreword
This Standard is drafted according to the rules given by GB/T 1.1-2009.
The Standard was proposed by the Ministry of Industry and Information Technology.
This Standard shall be under the jurisdiction of the Environment Standardization
Technical Committee of National Electrical and Electronic Products and Systems
(SAC/TC 297).
Main drafting organizations of this Standard. China Electronics Standardization
Institute, China Quality Certification Center, The Fifth Technology Institute of Ministry
of Industry and Information, Jiangsu Entry-Exit Inspection and Quarantine Bureau,
Nayou Technology (Beijing) Co., Ltd., and Shenzhen Metrology and Quality
Inspection Institute.
Main drafters of this Standard. Xing Weibing, Luo Daojun, Dong Yongsheng, He
Zhonghui, Gao Jian, Yang Lifeng, Jiang Wenbo, Chen Zeyong, and Li Yafang.
Requirements of concentration limits for certain restricted
substances in electrical and electronic products
1 Scope
This Standard specifies the maximum allowable content and compliance
determination rules of restricted substances in electrical and electronic products.
This Standard applies to the control of restricted substances such as lead (Pb),
mercury (Hg), cadmium (Cd), hexavalent chromium (Cr( )), polybrominated Ⅵ
biphenyls (PBB), and polybrominated diphenyl ethers (PBDE) in electrical and
electronic products.
2 Normative references
The provisions in following documents become the provisions of this Standard through
reference in this Standard. For dated references, the subsequent amendments
(excluding corrections) or revisions do not apply to this Standard.
GB/T 26125-2011 Electrical and electronic products - Determination of six
regulated substances (lead, mercury, cadmium, hexavalent chromium,
polybrominated biphenyls, polybrominated diphenyl ethers) (IEC 62321.2008, IDT)
3 Terms and definitions
The following terms and definitions apply to this document.
3.1
restricted substances
The substances that are required by laws and regulations or customer to be used
restrictedly in electrical and electronic products.
3.2
electrical and electronic products
EEP
The equipment and ancillary products that rely on current or magnetic field to work;
generate, transmit and measure such current and magnetic field; the rated working
voltage of which does not exceed 1500 V in direct current, and does not exceed 1000
V in alternate current.
Annex A
(Normative)
Disassembly of electrical and electronic products
A.1 Structure of electrical and electronic products
A.1.1 Composition structure
A.1.1.1 Complete machines. The equipment that can perform specific functions
individually, such as televisions, telephones, computers, and washing machines.
A.1.1.2 Parts/components. The structural units that can be disassembled only with
simple tools, such as boards, power supplies, and modules.
A.1.1.3 Components. The electronic components or electronic devices that constitute
circuit boards, such as resistors, capacitors, integrated circuits, optoelectronic devices,
and connectors.
A.1.1.4 Raw materials. The basic materials that constitute parts or components, such
as metal, plastic, solder, adhesives, and coating materials.
A.1.2 Classification of connection methods
A.1.2.1 Physical connections. The method that connects or fixes different components
and parts by physical forces such as pressure, friction, and gravity. Usually by
crimping, riveting, bonding, taping, threaded connection, fastening, and surrounding.
A.1.2.2 Chemical connections. The connections between different materials,
components, and parts by the methods of metallurgical or chemical reactions. Usually
by welding, electroplating, and electroless plating.
A.2 Prepare and requirements of disassembly
A.2.1 Environment
A.2.1.1 Disassembly area
Disassembly area shall be relatively independent, and sufficient for disassembly
operation. KEEP the disassembly environment clean. KEEP the indoor temperature
and humidity to be appropriate and being monitored. It shall avoid the direct sunlight.
A.2.1.2 Disassembly bench
Disassembly bench shall be smooth, clean, wear-resistant, corrosion-resistant, and
has sufficient loading capacity. The bench-board area shall meet the requirements of
disassembly operation and sample placement.
A.2.7.1 If the samples contain impurities such as dust and oil that may affect test
results, it shall be necessarily cleaned or decontaminated before disassembly.
Cleaning agents and decontamination method shall not change the composition of
samples.
A.2.7.2 Samples shall be stored under specified terms and appropriate conditions.
A.2.7.3 Transfer of samples shall remain stable compositions.
A.2.8 Record and preservation of disassembly process
A.2.8.1 Record requirements
Samples shall have unique identifications. The records of disassembly process shall
be complete, including disassembly environment, disassembly equipment and tools,
disassembly results, sample identification, and other relevant information required
special record.
A.2.8.2 Record tables
Disassembly record table of electrical and electronic products may include. part name,
material name, specifications/models, size, quality, color, material production plants,
etc.
A.3 Disassembly objectives and disassembly principles of electrical and
electronic products
A.3.1 Disassembly objectives
In order to determine the content of restricted materials in electrical and electronic
products, and to achieve the objective of controlling the use of restricted substances
in electrical and electronic products effectively, it shall disassemble the electrical and
electronic products into test units before test (as shown in Table 1).
A.3.2 Disassembly principles
A.3.2.1 General principle. DISASSEMBLE the samples according to the principle of
disassembling into homogeneous materials as far as possible.
A.3.2.2 The test units that can be disassembled into homogeneous materials are
classified as EEP-A. The test units that can not be disassembled into homogeneous
materials are classified as EEP-B and EEP-C.
A.3.2.3 In order to give consideration to both operability and economy, it shall refer to
Annex D to assess the possibility grade of the existence of restricted substances
before disassembly, so as to guide the subsequent sample disassembly, and obtain a
better disassembly program.
A.3.2.4 When disassembling, it shall firstly consider to SEPARATE t...
...... Source: Above contents are excerpted from the PDF -- translated/reviewed by: www.chinesestandard.net / Wayne Zheng et al.
|