|
Std ID |
Description (Standard Title) |
Detail |
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SJ 21474-2018
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(Multidimensional representation and availability assessment method for spectrum resources)
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SJ 21474-2018
|
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SJ 21475-2018
|
(Indium phosphide single wafer geometric parameter test method)
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SJ 21475-2018
|
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SJ 21476-2018
|
Technical requirements for annealing of InP single crystal
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SJ 21476-2018
|
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SJ 21477-2018
|
Technical requirements for InP poly crystal synthesis process
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SJ 21477-2018
|
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SJ 21478-2018
|
(Indium phosphide single crystal growth process technical requirements)
|
SJ 21478-2018
|
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SJ 21479-2018
|
(Indium phosphide wafer grinding process technical requirements)
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SJ 21479-2018
|
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SJ 21480-2018
|
(Flexible printed board lamination process control requirements)
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SJ 21480-2018
|
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SJ 21481-2018
|
(High-speed circuit wire characteristic impedance control requirements)
|
SJ 21481-2018
|
|
SJ 21486-2018
|
Specification for hydrosphere sealing composite conductive rubber strip
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SJ 21486-2018
|
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SJ 21487-2018
|
(Electromagnetic shielding heat shrinkable tube specification)
|
SJ 21487-2018
|
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SJ 21488-2018
|
(Rubber based absorber specification)
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SJ 21488-2018
|
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SJ 21489-2018
|
Specification for electric heating shielding glass for display screen
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SJ 21489-2018
|
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SJ 21490-2018
|
(Multi-layer co-fired ceramics manufacturing process route design requirements)
|
SJ 21490-2018
|
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SJ 21491-2018
|
(Multi-layer co-fired ceramics)
|
SJ 21491-2018
|
|
SJ 21492-2018
|
(Multi-layer co-fired ceramic blasting technology requirements)
|
SJ 21492-2018
|
|
SJ 21493-2018
|
Test method of surface defects for silicon carbide epitaxial wafers
|
SJ 21493-2018
|
|
SJ 21534-2018
|
Specification of gallium nitride epitaxial wafer for microwave power transistor
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SJ 21534-2018
|
|
SJ 21535-2018
|
Specification of silicon carbide epitaxial wafer for power electronic device
|
SJ 21535-2018
|
|
SJ 21536-2018
|
Specification of gallium arsenide epitaxial wafer for microwave power devices and monolithic microwave integrated circuits
|
SJ 21536-2018
|
|
SJ 21541-2018
|
(Electronic equipment 3D process data release requirements)
|
SJ 21541-2018
|
|
SJ 21543-2018
|
(Electronic equipment servo control system simulation requirements)
|
SJ 21543-2018
|
|
SJ 50033/197-2018
|
(Semiconductor optoelectronic device GH3202Z type optocoupler detailed specification)
|
SJ 50033/197-2018
|
|
SJ 50033/198-2018
|
(Semiconductor optoelectronic device GH3201Z-2 optocoupler detailed specification)
|
SJ 50033/198-2018
|
|
SJ 50033/199-2018
|
(Semiconductor optoelectronic device GH4420Z type optocoupler detailed specification)
|
SJ 50033/199-2018
|
|
SJ 58119/1-2018
|
(Semiconductor optoelectronic device GD3561T indium gallium arsenide photodiode detailed specification)
|
SJ 58119/1-2018
|
|
SJ 58119/2-2018
|
Semiconductor optoelectronic devices Detail specification for InGaAs photodiode of GD3562T
|
SJ 58119/2-2018
|
|
SJ 58119/3-2018
|
Semiconductor optoelectronic devices Detail specification for photodetector of GT322D-60-SM-FCIAPC
|
SJ 58119/3-2018
|
|
SJ/Z 21281-2018
|
(Printed board surface mounting plate graphic design guide)
|
SJ/Z 21281-2018
|
|
SJ/Z 21284-2018
|
(Printed Board Via Protection Design Guide)
|
SJ/Z 21284-2018
|
|
SJ/Z 21295-2018
|
(Core board selection guide for multilayer printed boards)
|
SJ/Z 21295-2018
|
|
SJ/Z 21296-2018
|
(Guide to making and using photographic plates for printed boards)
|
SJ/Z 21296-2018
|
|
SJ/Z 21297-2018
|
(Printed Board Graphics Imaging Guide)
|
SJ/Z 21297-2018
|
|
SJ/Z 21298-2018
|
(Printed Board Graphics Etching Guide)
|
SJ/Z 21298-2018
|
|
SJ/Z 21299-2018
|
(Multilayer printed board pressing guide)
|
SJ/Z 21299-2018
|
|
SJ/Z 21300-2018
|
(Printed Plate Electroplated Nickel Gold Processing Guide)
|
SJ/Z 21300-2018
|
|
SJ/Z 21301-2018
|
(Printed Board Ink Marking Processing Guide)
|
SJ/Z 21301-2018
|
|
SJ/Z 21302-2018
|
(Printed Board Outline Milling Guide)
|
SJ/Z 21302-2018
|
|
SJ/Z 21336-2018
|
(Data Link Equipment Reliability Design Guide)
|
SJ/Z 21336-2018
|
|
SJ/Z 21337-2018
|
(Data chain equipment maintainability design guide)
|
SJ/Z 21337-2018
|
|
SJ/Z 21410-2018
|
(Data Link Equipment Supportability Design Guide)
|
SJ/Z 21410-2018
|
|
SJ/Z 21411-2018
|
(Data Chain Equipment Testability Design Guide)
|
SJ/Z 21411-2018
|
|
SJ/Z 21484-2018
|
(Radar Admission Terminal Security Design Guide)
|
SJ/Z 21484-2018
|
|
SJ 20120A-2018
|
(General technical requirements and test methods for airborne fire control radar feeder unit)
|
SJ 20120A-2018
|
|
SJ 20130A-2018
|
(Method for detecting adhesion strength of metal plating)
|
SJ 20130A-2018
|
|
SJ 20138A-2018
|
(Specification of Nd-doped Yttrium Aluminum Garnet Laser Bar)
|
SJ 20138A-2018
|
|
SJ 20146A-2018
|
(General Specification for Silver Plating)
|
SJ 20146A-2018
|
|
SJ 20147.1A-2018
|
(Silver and silver alloy coating thickness test method X-ray fluorescence spectrometry)
|
SJ 20147.1A-2018
|
|
SJ 20147.2A-2018
|
(Test methods for silver and silver alloy coatings Determination of residual salt)
|
SJ 20147.2A-2018
|
|
SJ 20149A-2018
|
(Specification for aluminum metallized polyester film for capacitors)
|
SJ 20149A-2018
|
|
SJ 20150A-2018
|
(Specification for aluminum metallized polypropylene film for capacitors)
|
SJ 20150A-2018
|
|
SJ 20347A-2018
|
(General technical requirements and test methods for airborne fire control radar antenna unit)
|
SJ 20347A-2018
|
|
SJ 20358A-2018
|
(General specifications for optical fibre communication equipment for analogue TV signals)
|
SJ 20358A-2018
|
|
SJ 20359A-2018
|
(Analog TV signal optical fiber communication equipment measurement method)
|
SJ 20359A-2018
|
|
SJ 20390A-2018
|
(Specification for glass-metal joints for electronic devices)
|
SJ 20390A-2018
|
|
SJ 20443A-2018
|
(Specification for rhodium plating)
|
SJ 20443A-2018
|
|
SJ 20444A-2018
|
(Specification of lithium niobate single crystal)
|
SJ 20444A-2018
|
|
SJ 20449A-2018
|
(Specification for potting compound and ceramic material for power type ceramic shell resistor)
|
SJ 20449A-2018
|
|
SJ 20474A-2018
|
(Cold cathode trigger tube general specification)
|
SJ 20474A-2018
|
|
SJ 20475A-2018
|
(Cold cathode trigger tube test method)
|
SJ 20475A-2018
|
|
SJ 20499A-2018
|
(General specifications for mobile wheels of military electronic cabin)
|
SJ 20499A-2018
|
|
SJ 20513A-2018
|
(Specification for tungsten tape for military tube)
|
SJ 20513A-2018
|
|
SJ 20514A-2018
|
(Specification for silicon epitaxial wafers for microwave power transistors)
|
SJ 20514A-2018
|
|
SJ 20521A-2018
|
(General specification for military portable computers)
|
SJ 20521A-2018
|
|
SJ 20548A-2018
|
(General specification for optical time domain reflectometer)
|
SJ 20548A-2018
|
|
SJ 20598A-2018
|
(General specification for metal elastic shielding gasket)
|
SJ 20598A-2018
|
|
SJ 20605A-2018
|
(Specification for lithium tantalate single crystal for surface acoustic wave (SAW) devices)
|
SJ 20605A-2018
|
|
SJ 20640A-2018
|
(Specification for indium antimonide single chip for infrared detector)
|
SJ 20640A-2018
|
|
SJ 20641A-2018
|
(Specification for indium antimonide single crystal for infrared detector)
|
SJ 20641A-2018
|
|
SJ 20670A-2018
|
(Zirconium aluminum getter specifications)
|
SJ 20670A-2018
|
|
SJ 20703A-2018
|
(General specifications for TV seekers)
|
SJ 20703A-2018
|
|
SJ 20717A-2018
|
(Specification of zinc oxide piezoelectric film)
|
SJ 20717A-2018
|
|
SJ 20755B-2018
|
(General specification for military electromagnetic shielding ventilation windows)
|
SJ 20755B-2018
|
|
SJ 20796A-2018
|
(General specification for ground alert guidance radar antenna drive controller)
|
SJ 20796A-2018
|
|
SJ 20812A-2018
|
(Regulations on the design and management of military electronic equipment)
|
SJ 20812A-2018
|
|
SJ 20828A-2018
|
(Test pattern and general layout for qualified qualification of printed boards)
|
SJ 20828A-2018
|
|
SJ 20844A-2018
|
(Semi-insulating gallium arsenide single crystal micro area uniformity test method)
|
SJ 20844A-2018
|
|
SJ 20846A-2018
|
(Specification for gold gold cyanide for electroplating)
|
SJ 20846A-2018
|
|
SJ 20894A-2018
|
(Selection and use requirements of potting materials for electronic equipment parts)
|
SJ 20894A-2018
|
|
SJ 20910A-2018
|
(General specification for powder electrostatic coating)
|
SJ 20910A-2018
|
|
SJ 20921A-2018
|
(General Specification for the System of Military Air Traffic Control Center)
|
SJ 20921A-2018
|
|
SJ 20924A-2018
|
(Requirements for structural design of secret communication and information security equipment)
|
SJ 20924A-2018
|
|
SJ 20925A-2018
|
(General specification for military low-leakage shelters)
|
SJ 20925A-2018
|
|
SJ 20938A-2018
|
(Testing method of microwave frequency converter)
|
SJ 20938A-2018
|
|
SJ 20953A-2018
|
(General specification for duplex frequency hopping radio)
|
SJ 20953A-2018
|
|
SJ 21261-2018
|
(MEMS inertial device structural design requirements)
|
SJ 21261-2018
|
|
SJ 21262-2018
|
(Technical requirements for on-chip testing of MEMS inertial device chips)
|
SJ 21262-2018
|
|
SJ 21263-2018
|
(Technical requirements for calibration of MEMS acceleration sensor parameters)
|
SJ 21263-2018
|
|
SJ 21264-2018
|
(MEMS acceleration sensor test method)
|
SJ 21264-2018
|
|
SJ 21265-2018
|
(Technical requirements for MEMS gyroscope parameter calibration process)
|
SJ 21265-2018
|
|
SJ 21266-2018
|
(MEMS gyroscope test method)
|
SJ 21266-2018
|
|
SJ 21267-2018
|
(Microwave component reliability design requirements)
|
SJ 21267-2018
|
|
SJ 21268-2018
|
(Requirements for anti-static design of microwave components)
|
SJ 21268-2018
|
|
SJ 21269-2018
|
(Technical requirements for solder paste printing process of microwave component printed board)
|
SJ 21269-2018
|
|
SJ 21270-2018
|
(Test method for shock response spectrum of microwave components)
|
SJ 21270-2018
|
|
SJ 21271-2018
|
(Microwave component temperature-humidity-vibration comprehensive stress test method)
|
SJ 21271-2018
|
|
SJ 21272-2018
|
(Test method of microwave attenuator)
|
SJ 21272-2018
|
|
SJ 21273-2018
|
(Testing method of microwave phase shifter)
|
SJ 21273-2018
|
|
SJ 21274-2018
|
(Testing method of microwave T / R components)
|
SJ 21274-2018
|
|
SJ 21326-2018
|
(Technical requirements for ceramic shell plug-in mounting)
|
SJ 21326-2018
|
|
SJ 21327-2018
|
(Technical requirements for the mounting process of ceramic shell)
|
SJ 21327-2018
|