| CART (Up to 12 items/PDFs). How to add more items? Search 'GB/T 1.1' --> Add to Cart |
| Delete | 1 | SJ 50918/8-2016_ENGLISH | (WJ24 type screw drive non-wire wound pre-potentiometer detailed specification) | 1 | 3 | 199 | | Need to translate |
| Delete | 2 | SJ 21444-2018_ENGLISH | Specification for gallium oxide monocrystalline wafers of β-Ga203-N | 1 | 4 | 399 | | Need to translate |
| Delete | 3 | SJ 21434-2018_ENGLISH | (Military electronic equipment based on model definition T/R component requirements) | 1 | 4 | 499 | | Need to translate |
| Delete | 4 | SJ 21432-2018_ENGLISH | (Military electronic equipment based on model definitions) | 1 | 3 | 299 | | Need to translate |
| Delete | 5 | SJ 21331-2018_ENGLISH | Ceramic packages and metal packages Technical requirements for the heat treatment of the metal parts process | 1 | 3 | 299 | | Need to translate |
| Delete | 6 | SJ 21436-2018_ENGLISH | (Military electronic equipment based on model definition) | 1 | 3 | 299 | | Need to translate |
| Delete | 7 | SJ 21446-2018_ENGLISH | (CdS-N-T type cadmium sulfide single wafer specification for infrared/ultraviolet two-color detection) | 1 | 4 | 499 | | Need to translate |
| Delete | 8 | SJ 21360-2018_ENGLISH | (General requirements for three-dimensional machine plus process design of electronic equipment) | 1 | 3 | 299 | | Need to translate |
| Delete | 9 | SJ 21452-2018_ENGLISH | (Integrated circuit ceramic package, chip adhesive bonding, technical requirements) | 1 | 3 | 299 | | Need to translate |
| Delete | 10 | SJ 21435-2018_ENGLISH | (Military electronic equipment based on model definition) | 1 | 4 | 449 | | Need to translate |
| Delete | 11 | SJ 21429-2018_ENGLISH | (Digital design requirements for flexible cables for military electronic equipment) | 1 | 4 | 399 | | Need to translate |
| Delete | 12 | SJ 21430-2018_ENGLISH | (General requirements for the construction of military electronic equipment industrial design models) | 1 | 3 | 299 | | Need to translate |
| More PDF Samples Total (USD) | 4238.00 |