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Std ID |
Description (Standard Title) |
Detail |
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SJ/T 11847.1.2-2022
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(Flexible Display Devices - Part 1-2: General Specifications)
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SJ/T 11847.1.2-2022
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SJ/T 11847.3.1-2022
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(Flexible display devices - Part 3-1: Detailed specification for side-curved flexible display modules)
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SJ/T 11847.3.1-2022
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SJ/T 11847.3.2-2022
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(Flexible display devices - Part 3-2: Detail specification for outside-folding flexible display modules)
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SJ/T 11847.3.2-2022
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SJ/T 11848-2022
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(Detailed specification for semiconductor discrete devices 3DG2484 type NPN silicon high frequency low power transistor)
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SJ/T 11848-2022
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SJ/T 11849-2022
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(Semiconductor discrete devices 3DG3500, 3DG3501 type NPN silicon high-frequency low-power transistor detailed specification)
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SJ/T 11849-2022
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SJ/T 11850-2022
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(Semiconductor discrete devices 3DK2219A, 3DK2222A, 3DK2222AUB type NPN silicon small power switching transistor detailed specification)
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SJ/T 11850-2022
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SJ/T 11851-2022
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(Semiconductor Discrete Devices S3DK5794 Type NPN Silicon Low Power Switching Transistor Pair Detail Specification)
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SJ/T 11851-2022
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SJ/T 11852-2022
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(General specification for lithium-ion cells and battery packs for service robots)
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SJ/T 11852-2022
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SJ/T 11853-2022
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(Positive pressure suspension zone melting single crystal silicon furnace)
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SJ/T 11853-2022
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SJ/T 11854-2022
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(Czochralski monocrystalline silicon furnace for photovoltaic)
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SJ/T 11854-2022
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SJ/T 11855-2022
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(Photovoltaic UV aging test chamber irradiation performance test method)
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SJ/T 11855-2022
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SJ/T 11856.1-2022
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(Technical Specifications for Diode Laser Chips for Optical Fiber Communication - Part 1: Light Source Fabry-Perot Type and Distributed Feedback Diode Laser Chips)
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SJ/T 11856.1-2022
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SJ/T 11856.2-2022
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(Technical Specifications for Diode Laser Chips for Optical Fiber Communications - Part 2: Vertical Cavity Surface Emitting Diode Laser Chips for Light Sources)
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SJ/T 11856.2-2022
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SJ/T 11856.3-2022
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(Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications - Part 3: Electrical Absorption Modulation Semiconductor Laser Chips for Light Sources)
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SJ/T 11856.3-2022
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SJ/T 11857-2022
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(Electronically commutated brushless DC motors for home appliances)
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SJ/T 11857-2022
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SJ/T 11858-2022
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(SMD Micro Vibrator)
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SJ/T 11858-2022
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SJ/T 11859-2022
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(General specification for single-phase permanent magnet synchronous motors for micro pumps)
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SJ/T 11859-2022
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SJ/T 11860-2022
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(Electroplating solution test method)
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SJ/T 11860-2022
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SJ/T 11862-2022
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(Lithium battery terms)
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SJ/T 11862-2022
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SJ/T 11863-2022
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(Specifications for single-chip oversized reticle loading boxes)
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SJ/T 11863-2022
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SJ/T 11864-2022
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(Semi-insulating silicon carbide single crystal substrate)
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SJ/T 11864-2022
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SJ/T 11865-2022
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(Φ 150 mm n-type silicon carbide substrate for power devices)
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SJ/T 11865-2022
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SJ/T 11866-2022
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(Semiconductor optoelectronic devices - Silicon substrate white power light emitting diodes - Detail specification)
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SJ/T 11866-2022
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SJ/T 11867-2022
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(Detail specification for blue light low power light emitting diode chip on silicon substrate)
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SJ/T 11867-2022
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SJ/T 11868-2022
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(Detail specification for blue power light emitting diode chip on silicon substrate)
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SJ/T 11868-2022
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SJ/T 11869-2022
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(Detail specification for silicon substrate white light power light emitting diode chip)
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SJ/T 11869-2022
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SJ/T 11870-2022
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(Performance test methods for light sensors for lighting)
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SJ/T 11870-2022
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SJ/T 11871-2022
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(Performance requirements for infrared sensors for lighting)
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SJ/T 11871-2022
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SJ/T 11872-2022
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(Performance requirements for illuminance sensors for lighting)
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SJ/T 11872-2022
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SJ/T 11873-2022
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(General specification for ultrasonic distance measuring sensors)
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SJ/T 11873-2022
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SJ/T 11874-2022
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(Stress Test Procedures for Semiconductor Discrete Devices Used in Electric Vehicles)
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SJ/T 11874-2022
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SJ/T 11875-2022
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(Stress test procedure for semiconductor integrated circuits used in electric vehicles)
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SJ/T 11875-2022
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SJ/T 11876-2022
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(Guidelines for the Management and Implementation Evaluation of Hazardous Substances in Electrical and Electronic Products)
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SJ/T 11876-2022
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SJ/T 11877-2022
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(Green Factory Evaluation Requirements for Printer and Multifunction Machine Manufacturing Industry)
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SJ/T 11877-2022
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SJ/T 11878-2022
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(Evaluation requirements for green factories in TV manufacturing industry)
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SJ/T 11878-2022
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SJ/T 11879-2022
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(Evaluation requirements for green parks of electronic information manufacturing industry)
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SJ/T 11879-2022
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SJ/T 11880-2022
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(Green Factory Evaluation Requirements for Light-Emitting Diode Manufacturing Industry)
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SJ/T 11880-2022
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SJ/T 11881-2022
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(Evaluation Requirements for Green Factory in Microcomputer Manufacturing Industry)
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SJ/T 11881-2022
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SJ/T 11882-2022
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(Evaluation Requirements for Green Factory in LCD Panel Manufacturing Industry)
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SJ/T 11882-2022
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SJ/T 11883-2022
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(The Calculation Method of Heat Balance, Heat Efficiency and Comprehensive Energy Consumption of Diffusion Furnace)
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SJ/T 11883-2022
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SJ/T 11884-2022
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(Technical specification for energy-saving diagnosis of electronic glass manufacturing industry)
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SJ/T 11884-2022
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SJ/T 11885-2022
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(Green supply chain management specification for power lithium-ion battery industry)
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SJ/T 11885-2022
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SJ/T 2862-2022
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(Detail specification for fixed resistors for electronic equipment RXG5 type wire wound power type fixed resistors Assessment level E)
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SJ/T 2862-2022
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SJ/T 2863-2022
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(Detail specification for fixed resistors for electronic equipment RXG6 type wire wound power type fixed resistors Assessment level E)
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SJ/T 2863-2022
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SJ/T 2864-2022
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(Detail specification for fixed resistors for electronic equipment RXG7 type wire wound power type fixed resistors Assessment level E)
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SJ/T 2864-2022
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SJ/T 2867-2022
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(Detail specification for fixed resistors for electronic equipment Type RI40 Glass glaze film low power fixed resistors Assessment level E)
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SJ/T 2867-2022
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SJ/T 2911-2022
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(Detail specification for potentiometers for electronic equipment WH159 type low power potentiometers Assessment level E)
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SJ/T 2911-2022
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SJ/T 11584.3-2022
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(Information Technology Social Service Management Technical Specifications for 3D Digital Social Service Management System - Part 3: Business Handling)
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SJ/T 11584.3-2022
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SJ/T 11584.6-2022
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(Information technology - Social service management - Technical specifications for 3D digital social service management system - Part 6: Assisted decision-making)
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SJ/T 11584.6-2022
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SJ/T 10297-2023
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(General Specifications for LCR Meters)
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SJ/T 10297-2023
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SJ/T 10581-2023
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(General specification for vacuum switch tubes for low-voltage circuit breakers)
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SJ/T 10581-2023
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SJ/T 10582-2023
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(Test method of vacuum switch tube for low voltage circuit breaker)
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SJ/T 10582-2023
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SJ/T 11828.3-2023
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(Photovoltaic Module Natural Exposure Test and Annual Attenuation Rate Evaluation - Part 3: Moderate Climate Urban Environment)
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SJ/T 11828.3-2023
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SJ/T 11886-2023
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(Structured Light Handheld 3D Scanner)
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SJ/T 11886-2023
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SJ/T 11887.1-2023
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(Information technology - Telecommunication and information exchange between systems - Time-division multiplexed low-power short-range wireless networks - Part 1: Physical layer)
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SJ/T 11887.1-2023
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SJ/T 11887.2-2023
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(Information technology - Telecommunication and information exchange between systems - Time-division multiplexed low-power short-range wireless networks - Part 2: Link layer)
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SJ/T 11887.2-2023
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SJ/T 11887.3-2023
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(Information technology - Telecommunications and information exchange between systems - Time-division multiplexed low-power short-range wireless networks - Part 3: Network layer)
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SJ/T 11887.3-2023
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SJ/T 11889-2023
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(Roller Press for Lithium-ion Batteries)
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SJ/T 11889-2023
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SJ/T 11890-2023
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Design requirement of energy conservation for LED displays
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SJ/T 11890-2023
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SJ/T 11891-2023
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Energy efficiency measurement method for LED displays
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SJ/T 11891-2023
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SJ/T 11892-2023
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(General Specifications for Pseudocapacitive Supercapacitors)
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SJ/T 11892-2023
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SJ/T 11893-2023
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(Technical specification for portable lithium-ion battery energy storage power supply)
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SJ/T 11893-2023
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SJ/T 11894-2023
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(General Specifications for Marine Supercapacitors)
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SJ/T 11894-2023
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SJ/T 11895-2023
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(Specifications for electric double-layer supercapacitors for energy-saving elevators)
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SJ/T 11895-2023
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SJ/T 11896-2023
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(Technical specifications for outdoor image inspection terminals powered by photovoltaics)
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SJ/T 11896-2023
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SJ 20382-2021
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(Specification for wedge locking devices)
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SJ 20382-2021
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SJ 20637-2021
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(Specification for aluminum nitride powder for military electronic ceramics)
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SJ 20637-2021
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SJ 21085-2016
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(Specification for bonding sheets for rigid multilayer printed boards)
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SJ 21085-2016
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SJ 21101-2016
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(LF40-50 type spiral cable specification)
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SJ 21101-2016
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SJ 21473.6-2021
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(Methods of measuring electromagnetic immunity of military integrated circuits - Part 6: Impulse immunity measurement - Synchronous transient injection method)
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SJ 21473.6-2021
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SJ 21473.7-2021
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(Methods of measuring electromagnetic immunity of military integrated circuits - Part 7: Measurement of pulse immunity - non-synchronous transient injection method)
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SJ 21473.7-2021
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SJ 21585-2021
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(Permanent magnet declination measurement method)
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SJ 21585-2021
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SJ 21586-2021
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(Additive Manufacturing Process Requirements for Selected Area Laser Melting of Aluminum Alloys for Military Electronic Equipment)
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SJ 21586-2021
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SJ 21588-2021
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(Indium Phosphide Crystal Ingot Cutting and Orientation Technology Requirements)
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SJ 21588-2021
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SJ 21589-2021
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(Indium Phosphide Ingot Rolling Technology Requirements)
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SJ 21589-2021
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SJ 21590-2021
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(Indium Phosphide Wafer Chamfering Technology Requirements)
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SJ 21590-2021
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SJ 21591-2021
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(Semi-insulating indium phosphide single wafer resistivity, mobility and uniformity test method)
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SJ 21591-2021
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SJ 21592-2021
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(General requirements for electronic equipment support data management)
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SJ 21592-2021
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SJ 21593-2021
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(General technical requirements for electronic equipment health management)
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SJ 21593-2021
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SJ 21594-2021
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(General requirements for assembly of pillar grid array packaged devices)
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SJ 21594-2021
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SJ 21595-2021
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(General specification for micro-arc oxidation coating)
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SJ 21595-2021
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SJ 21596-2021
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(Graphene anti-corrosion coating specification)
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SJ 21596-2021
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SJ 21597-2021
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(General specification for anti-corrosion coating of electronic equipment)
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SJ 21597-2021
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SJ 21598-2021
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(Technical requirements for multi-layer stacking process based on flip-chip welding)
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SJ 21598-2021
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SJ 21599-2021
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(Design requirements for discontinuous metallized holes in printed boards)
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SJ 21599-2021
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SJ 21600-2021
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(Test method for X/Y axis thermal expansion coefficient of substrates for printed circuits - TMA method)
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SJ 21600-2021
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SJ 21601-2021
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(Specification for copper clad hydrocarbon resin fiberglass cloth laminates for high frequency circuits)
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SJ 21601-2021
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SJ 21602-2021
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(Surface Mount Stencil and Misprinted Board Cleaning Requirements)
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SJ 21602-2021
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SJ 21603-2021
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(Surface Mount Stencil Design and Manufacturing Requirements)
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SJ 21603-2021
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SJ 21610-2021
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(Technical requirements for command information system service integration)
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SJ 21610-2021
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SJ 21611-2021
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(Manufacturing process requirements for liquid cooling modules of military electronic equipment)
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SJ 21611-2021
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SJ 21612-2021
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(Broadband Real-time Low Power Bus Requirements for Electronic Warfare Microsystems)
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SJ 21612-2021
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SJ 21614-2021
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(Anti-oxidation control requirements for SMC/SMD devices used in military electronic equipment)
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SJ 21614-2021
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SJ 21615-2021
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(General requirements for digital twins of military electronic equipment)
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SJ 21615-2021
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SJ 21616-2021
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(Digital twin model construction requirements for military electronic equipment)
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SJ 21616-2021
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SJ 21617-2021
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(Digital twin data acquisition and processing requirements for military electronic equipment)
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SJ 21617-2021
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SJ 21618-2021
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(Digital twin application requirements for military electronic equipment)
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SJ 21618-2021
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SJ 21619-2021
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(DC input passive EMI filter test method)
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SJ 21619-2021
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SJ 21620-2021
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(Technical requirements for multi-layer low temperature co-fired ceramic green tape)
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SJ 21620-2021
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SJ 21621-2021
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(General Specifications for Indium Column Stripping Machines)
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SJ 21621-2021
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