|
Std ID |
Description (Standard Title) |
Detail |
|
SJ 21388-2018
|
(Multi-layer co-fired ceramic raw ceramic strip slicing and assembly process technical requirements)
|
SJ 21388-2018
|
|
SJ 21389-2018
|
(Technical requirements for through-hole filling of multilayer co-fired ceramic green sheets)
|
SJ 21389-2018
|
|
SJ 21390-2018
|
(Multi-layer co-fired ceramics Multi-layer green ceramic laminate technology requirements)
|
SJ 21390-2018
|
|
SJ 21399-2018
|
(Microelectronic package ceramic and metal shell assembly inspection requirements)
|
SJ 21399-2018
|
|
SJ 21400-2018
|
(Microelectronics packaging ceramics and metal enclosures, metal parts inspection requirements)
|
SJ 21400-2018
|
|
SJ 21401-2018
|
(Technical requirements for edging and splitting of microelectronic package ceramic shell)
|
SJ 21401-2018
|
|
SJ 21402-2018
|
(Technical requirements for post-brazing treatment of microelectronic package ceramics and metal shells)
|
SJ 21402-2018
|
|
SJ 21465-2018
|
(High-density interconnect layer or printed board performance specifications)
|
SJ 21465-2018
|
|
SJ 21466-2018
|
(Printed board safety performance evaluation)
|
SJ 21466-2018
|
|
SJ 21473.1-2018
|
(Measurement methods of electromagnetic immunity for military integrated circuits. Part 1: General conditions and definitions)
|
SJ 21473.1-2018
|
|
SJ 21473.2-2018
|
(Military integrated circuit electromagnetic immunity measurement method. Part 2: Radiation immunity measurement-TEM cell and broadband TEM cell method)
|
SJ 21473.2-2018
|
|
SJ 21473.3-2018
|
(Military integrated circuit electromagnetic immunity measurement method. Part 3: Conducted immunity measurement-large current injection (BCI) method)
|
SJ 21473.3-2018
|
|
SJ 21473.4-2018
|
(Military integrated circuit electromagnetic immunity measurement method. Part 4: Conducted immunity measurement-RF power direct injection method)
|
SJ 21473.4-2018
|
|
SJ 21473.5-2018
|
(Measurement method of electromagnetic immunity for military integrated circuits. Part 5: Conducted immunity measurement-workbench Faraday cage)
|
SJ 21473.5-2018
|
|
SJ 21494.1-2018
|
(Standardization Requirements for Safe Production in Military Electronics Industry Part 1: Integrated Management)
|
SJ 21494.1-2018
|
|
SJ 21494.2-2018
|
(Standardization requirements for safe production in military electronics industry Part 2: Clean workshop)
|
SJ 21494.2-2018
|
|
SJ 21494.3-2018
|
(Standardization requirements for safe production in military electronics industry Part 3: Coating operations)
|
SJ 21494.3-2018
|
|
SJ 21494.4-2018
|
(Standardization requirements for safe production in military electronics industry Part 4: Large equipment erection and installation)
|
SJ 21494.4-2018
|
|
SJ 21494.5-2018
|
(Standardization requirements for safe production in military electronics industry Part 5: Assembly operations)
|
SJ 21494.5-2018
|
|
SJ 21494.6-2018
|
(Standardization requirements for safe production in military electronics industry Part 6: Microwave darkroom)
|
SJ 21494.6-2018
|
|
SJ 21494.7-2018
|
(Standardization requirements for safe production in military electronics industry Part 7: Electronic assembly operations)
|
SJ 21494.7-2018
|
|
SJ 21495-2018
|
(Microelectronic packaging shell packaging technology requirements)
|
SJ 21495-2018
|
|
SJ 21496-2018
|
(Technical requirements for gold plating process of microelectronic packaging shell)
|
SJ 21496-2018
|
|
SJ 21497-2018
|
(Technical requirements of surface acoustic wave device lithography)
|
SJ 21497-2018
|
|
SJ 21498-2018
|
(Technical requirements for surface acoustic wave device coating process)
|
SJ 21498-2018
|
|
SJ 21499-2018
|
(Technical requirements for dicing process of surface acoustic wave device)
|
SJ 21499-2018
|
|
SJ 21500-2018
|
(Technical requirements for cap sealing technology of surface acoustic wave devices)
|
SJ 21500-2018
|
|
SJ 21505-2018
|
(Software radio hardware platform reconfigurable design requirements)
|
SJ 21505-2018
|
|
SJ 21506-2018
|
(Software radio high real-time software platform design requirements)
|
SJ 21506-2018
|
|
SJ 21507-2018
|
(Software radio waveform reconfigurable design requirements)
|
SJ 21507-2018
|
|
SJ 21508-2018
|
(Design requirements of software radio universal receiving technology)
|
SJ 21508-2018
|
|
SJ 21509-2018
|
(Software radio general launch technical design requirements)
|
SJ 21509-2018
|
|
SJ 21510-2018
|
(Technical requirements for software radio data distribution and exchange)
|
SJ 21510-2018
|
|
SJ 21511-2018
|
(Software radio general signal processing technology design requirements)
|
SJ 21511-2018
|
|
SJ 21512-2018
|
(Technical requirements for the processing of printed boards before electronic assembly)
|
SJ 21512-2018
|
|
SJ 21513-2018
|
(Requirements for the processing of moisture-sensitive components before electronic assembly)
|
SJ 21513-2018
|
|
SJ 21514-2018
|
(Requirements for quality control of solder paste printing process for electronic assembly)
|
SJ 21514-2018
|
|
SJ 21515-2018
|
(Microwave assembly gold wire bonding process requirements)
|
SJ 21515-2018
|
|
SJ 21516-2018
|
(Microwave component connector welding process requirements)
|
SJ 21516-2018
|
|
SJ 21517-2018
|
(Requirements for the three-proof process of printed board components)
|
SJ 21517-2018
|
|
SJ 21518-2018
|
(Requirements for the connection process of fasteners for military electronic equipment)
|
SJ 21518-2018
|
|
SJ 21519-2018
|
(Electronic equipment hybrid integrated circuit digital process design requirements)
|
SJ 21519-2018
|
|
SJ 21520-2018
|
(Digital design requirements for semi-rigid cable assemblies of electronic equipment)
|
SJ 21520-2018
|
|
SJ 21521-2018
|
(Requirements for digital process design of electronic equipment printed board components)
|
SJ 21521-2018
|
|
SJ 21522-2018
|
(Naming requirements for digital prototype models of electronic equipment)
|
SJ 21522-2018
|
|
SJ 21523-2018
|
(Technical requirements for post-printing process of multi-layer co-fired ceramics)
|
SJ 21523-2018
|
|
SJ 21524-2018
|
(Technical requirements for post-fired multi-layer co-fired ceramics)
|
SJ 21524-2018
|
|
SJ 21525-2018
|
(Multi-layer co-fired ceramic laser resistance adjustment technology requirements)
|
SJ 21525-2018
|
|
SJ 21526-2018
|
(Multilayer co-fired ceramic slicing technology requirements)
|
SJ 21526-2018
|
|
SJ 21527-2018
|
(Technical requirements for grinding and polishing of multi-layer co-fired ceramics)
|
SJ 21527-2018
|
|
SJ 21528-2018
|
(Technical requirements for multi-layer co-fired ceramic thin film metallized surface plating process)
|
SJ 21528-2018
|
|
SJ 21529-2018
|
(Multilayer co-fired ceramic surface layer sputtering process technical requirements)
|
SJ 21529-2018
|
|
SJ 21530-2018
|
(Technical requirements for multi-layer co-fired ceramic surface lithography process)
|
SJ 21530-2018
|
|
SJ 21531-2018
|
(Technical requirements for surface etching of multilayer co-fired ceramics)
|
SJ 21531-2018
|
|
SJ 21532-2018
|
(Technical requirements for electroless nickel plating and gold plating process for multi-layer co-fired ceramics)
|
SJ 21532-2018
|
|
SJ 21533-2018
|
(Technical requirements for multi-layer co-fired ceramics, nickel electroplating and gold plating process)
|
SJ 21533-2018
|
|
SJ 21542-2018
|
(Military electronic equipment defines cabinet requirements based on models)
|
SJ 21542-2018
|
|
SJ 21544-2018
|
(Control requirements and measurement of electromagnetic interference characteristics of military replaceable electronic modules)
|
SJ 21544-2018
|
|
SJ 21545-2018
|
(Requirements and measurement of electromagnetic compatibility of military radio frequency identification equipment)
|
SJ 21545-2018
|
|
SJ 30004-2018
|
(Military export data management requirements)
|
SJ 30004-2018
|
|
SJ 30005-2018
|
(General requirements for technical training of users of military trade products)
|
SJ 30005-2018
|
|
SJ 30006-2018
|
(Military software quality measurement guideline for the implementation of intelligence data processing software reliability quality measurement)
|
SJ 30006-2018
|
|
SJ 30007-2018
|
(Military Software Quality Measurement Implementation Guide for Intelligence Data Processing Software Ease of Use Quality Measurement)
|
SJ 30007-2018
|
|
SJ 30008-2018
|
(Military software quality measurement combined test method)
|
SJ 30008-2018
|
|
SJ 30009-2018
|
(Military software quality measurement automated test process model)
|
SJ 30009-2018
|
|
SJ 30010-2018
|
(Military software testing and verification)
|
SJ 30010-2018
|
|
SJ 30011-2018
|
(Military software test verification test process and management)
|
SJ 30011-2018
|
|
SJ 30012-2018
|
(Military software test verification test technology)
|
SJ 30012-2018
|
|
SJ 30013-2018
|
(Military software test verification test tool requirements)
|
SJ 30013-2018
|
|
SJ 30014-2018
|
(Military software test verification test document)
|
SJ 30014-2018
|
|
SJ 30015-2018
|
(Military Software Test Verification Criteria for Software Test Coverage Based on State Transition)
|
SJ 30015-2018
|
|
SJ 30016-2018
|
(HDL code writing guide)
|
SJ 30016-2018
|
|
SJ 30019-2018
|
(General rules for safety management of weaponry equipment scientific research and production process)
|
SJ 30019-2018
|
|
SJ 30020-2018
|
(Basic Requirements for Safety Production Responsibility System of Weapon Equipment Research and Production Units)
|
SJ 30020-2018
|
|
SJ 30021-2018
|
(Rules for Self-assessment of Work Safety Standardization of Weapon Equipment Research and Production Units)
|
SJ 30021-2018
|
|
SJ 30022-2018
|
(Safety requirements for weapon equipment production planning)
|
SJ 30022-2018
|
|
SJ 30023-2018
|
(Requirements for safety risk assessment at the stage of model engineering scheme)
|
SJ 30023-2018
|
|
SJ 30024-2018
|
(Work Regulations for Standardization Evaluation of Safe Production in Military Industry System)
|
SJ 30024-2018
|
|
SJ 30025-2018
|
(Requirements for emergency management of weaponry research and production safety)
|
SJ 30025-2018
|
|
SJ 30026-2018
|
(Accelerated test method for multi-factor combination simulation of organic coating marine environment)
|
SJ 30026-2018
|
|
SJ 30027-2018
|
(Rapid Evaluation of Atmospheric Corrosion and Graded Screw Galvanic Corrosion Method)
|
SJ 30027-2018
|
|
SJ 30028-2018
|
(Accelerated test method for exposure to natural environment under glass frame)
|
SJ 30028-2018
|
|
SJ 30029-2018
|
(Accelerated test method for tracking solar salt (acid) fog comprehensive exposure to natural environment)
|
SJ 30029-2018
|
|
SJ 30030.10-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 10: Component termination)
|
SJ 30030.10-2018
|
|
SJ 30030.1-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 1: Machining)
|
SJ 30030.1-2018
|
|
SJ 30030.2-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 2: Riveting)
|
SJ 30030.2-2018
|
|
SJ 30030.3-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 3: Injection)
|
SJ 30030.3-2018
|
|
SJ 30030.4-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 4: Heat treatment)
|
SJ 30030.4-2018
|
|
SJ 30030.5-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 5: Surface treatment)
|
SJ 30030.5-2018
|
|
SJ 30030.6-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements Part 6: Pouring glue)
|
SJ 30030.6-2018
|
|
SJ 30030.7-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements. Part 7: Glass sintering)
|
SJ 30030.7-2018
|
|
SJ 30030.8-2018
|
(Aerospace-grade and high-reliability electrical connector process control requirements. Part 8: Jack closure)
|
SJ 30030.8-2018
|
|
SJ 30030.9-2018
|
(Aerospace-grade and highly reliable electrical connector process control requirements. Part 9: Assembly of components and complete parts)
|
SJ 30030.9-2018
|
|
SJ 30034-2018
|
(General requirements of military big data system)
|
SJ 30034-2018
|
|
SJ 30035-2018
|
(Guide for Military Data Management Capability Evaluation)
|
SJ 30035-2018
|
|
SJ 50033/177-2018
|
(Semiconductor discrete devices 3CG2604, 3CG2604UB silicon PNP high frequency small power transistor detailed specifications)
|
SJ 50033/177-2018
|
|
SJ 50033/178-2018
|
(Semiconductor discrete devices 3CG2605, 3CG2605UB silicon PNP high frequency small power transistor detailed specifications)
|
SJ 50033/178-2018
|
|
SJ 50033/179-2018
|
(Semiconductor discrete devices 3CK2904, 3CK2905 silicon PNP high frequency small power switching transistors detailed specifications)
|
SJ 50033/179-2018
|
|
SJ 50033/180-2018
|
(Semiconductor discrete devices 3CK2906, 3CK2906UA, 3CK2906UB silicon PNP high frequency small power switching transistors detailed specifications)
|
SJ 50033/180-2018
|
|
SJ 50033/181-2018
|
(Semiconductor discrete devices 3CK2907, 3CK2907UA, 3CK2907UB silicon PNP high frequency small power switching transistors detailed specifications)
|
SJ 50033/181-2018
|