|
Std ID |
Description (Standard Title) |
Detail |
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SJ 20959-2006
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Printed board description in digital form
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SJ 20959-2006
|
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SJ 20960-2006
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General specification for fiber optical speed sensor
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SJ 20960-2006
|
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SJ 20961-2006
|
General principles of measuring methods of A/D and D/A converters for integrated circuits
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SJ 20961-2006
|
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SJ 2096-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS39
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SJ 2096-1982
|
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SJ 20962-2006
|
Detail specification for type LJDT-176.5M, LJDT-186M, LJDT-372M LC band pass filters
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SJ 20962-2006
|
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SJ 20963-2006
|
Method for determination the content of rhenium of tungsten-rhenium alloy
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SJ 20963-2006
|
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SJ 20964-2006
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Specification for tungsten-37 rhenium alloy
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SJ 20964-2006
|
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SJ 20965-2006
|
Specification for beryllia ceramic carrier used for photocon devices
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SJ 20965-2006
|
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SJ 20966-2006
|
Measuring methods for soft ferrite materials
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SJ 20966-2006
|
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SJ 20967-2007
|
Subsystem interoperability of the digital message transfer device
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SJ 20967-2007
|
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SJ 20968-2007
|
General specification for military sonar data-recording equipment
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SJ 20968-2007
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SJ 20969-2007
|
General specifications for multi-system secret speech terminal
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SJ 20969-2007
|
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SJ 20970-2007
|
General specification for vehicular mounted mine detection device
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SJ 20970-2007
|
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SJ 20971-2007
|
Specification for front locking device-type B of avionics cases
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SJ 20971-2007
|
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SJ 2097-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS40
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SJ 2097-1982
|
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SJ 20972-2007
|
General specification for imaging charge coupled assemblies
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SJ 20972-2007
|
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SJ 20973-2007
|
Capacitors, fixed, double polarized, electrolytic(solid electrolyte), tantalum, established reliability, general specification for
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SJ 20973-2007
|
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SJ 20974-2007
|
General specification for high temperature sintering elevator furnace
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SJ 20974-2007
|
|
SJ 20978.1-2007
|
Specifications for air traffic control system surveillance data exchange. Part 1: General structure
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SJ 20978.1-2007
|
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SJ 20978.2-2007
|
Specifications for air traffic control system surveillance data exchange. Part 2: Transmission of monoradar service messages
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SJ 20978.2-2007
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SJ 20978.3-2007
|
Specifications for air traffic control system surveillance data exchange. Part 3: Transmission of monoradar derived weather information
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SJ 20978.3-2007
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SJ 20978.4-2007
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Specifications for air traffic control system surveillance data exchange. Part 4: Transmission of monoradar target reports
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SJ 20978.4-2007
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SJ 20978.5-2007
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Specifications for air traffic control system surveillance data exchange. Part 5: Transmission of monosensor surface movement data
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SJ 20978.5-2007
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SJ 20978.6-2007
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Specifications for air traffic control system surveillance data exchange. Part 6: Transmission of automatic dependent surveillance broadcast (ADS-B) data
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SJ 20978.6-2007
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SJ 20978.7-2007
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Specifications for air traffic control system surveillance data exchange. Part 7: Transmission of system track messages
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SJ 20978.7-2007
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SJ 20978.8-2007
|
Specifications for air traffic control system surveillance data exchange. Part 8: Transmission of surveillance data processing system status messages
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SJ 20978.8-2007
|
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SJ 20979-2007
|
General specification for self-generating set of military vehicle
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SJ 20979-2007
|
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SJ 20980-2008
|
General technology requirement of tactical mobile ATM
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SJ 20980-2008
|
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SJ 20981-2008
|
General specification for common high-speed ditital radio
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SJ 20981-2008
|
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SJ 2098-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS41
|
SJ 2098-1982
|
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SJ 20982-2008
|
General specification for lifting device of radar system and communication equipment
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SJ 20982-2008
|
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SJ 20983-2008
|
General specification for self-loading and self-unloading device of radar system
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SJ 20983-2008
|
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SJ 20984-2008
|
General specification for chemical vapor deposition(CVD) equipment
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SJ 20984-2008
|
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SJ 20985-2008
|
Technological design guidelines for corrosion prevention and control in military electronic installation
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SJ 20985-2008
|
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SJ 20986-2008
|
General specification for bulk acoustoptic device
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SJ 20986-2008
|
|
SJ 20987/1-2016
|
(Detail specification for LCM104XA04 reinforced liquid crystal display)
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SJ 20987/1-2016
|
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SJ 20987-2008
|
General specification for military rugged liquid crystal display
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SJ 20987-2008
|
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SJ 20988-2008
|
Cables, VYJ9S series, field supply, for specification
|
SJ 20988-2008
|
|
SJ 20989-2008
|
Capacitors, electrolytic (nonsolid electrolyte), tantalum, combined, high capacitance type CA35N detail specification for
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SJ 20989-2008
|
|
SJ 2099-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS42
|
SJ 2099-1982
|
|
SJ 2100-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS43
|
SJ 2100-1982
|
|
SJ 2101-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS44
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SJ 2101-1982
|
|
SJ 210-1966
|
(Number of radio equipment for the production of industrial design documents (Trial))
|
SJ 210-1966
|
|
SJ 2102-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS45
|
SJ 2102-1982
|
|
SJ 2103-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS46
|
SJ 2103-1982
|
|
SJ 21040-2016
|
(Low Temperature Co - fired Ceramic Multilayer Substrates Manufacturing Major Process Equipment Terms)
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SJ 21040-2016
|
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SJ 21041-2016
|
(Standard Specification for Manufacturing Process Equipment for Low Temperature Co - fired Ceramic Multilayer Substrates)
|
SJ 21041-2016
|
|
SJ 2104-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS47
|
SJ 2104-1982
|
|
SJ 21042-2016
|
(Low Temperature Co - fired Ceramic Multilayer Substrate Manufacturing Line Test Verification Product Technical Requirements)
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SJ 21042-2016
|
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SJ 21043-2016
|
(Raw porcelain slicer general specification)
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SJ 21043-2016
|
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SJ 21044-2016
|
(Standard Specification for Porcelain Porcelain Punching Machine)
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SJ 21044-2016
|
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SJ 21045-2016
|
(General specification for microporous filling machines)
|
SJ 21045-2016
|
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SJ 21046-2016
|
(General specification for low temperature co - fired ceramic laminating machine)
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SJ 21046-2016
|
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SJ 21047-2016
|
(Standard Specification for Low Temperature Co - fired Ceramic Laminators)
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SJ 21047-2016
|
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SJ 21048-2016
|
(General specification for low temperature co - fired ceramic heat - cutting machine)
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SJ 21048-2016
|
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SJ 21049-2016
|
(General specification for eutectic welding machine)
|
SJ 21049-2016
|
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SJ 21050-2016
|
(General specification for eutectic furnaces)
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SJ 21050-2016
|
|
SJ 21051-2016
|
(Standard Specification for Hot - Pressed Ultrasonic Wrapping Welders)
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SJ 21051-2016
|
|
SJ 2105-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS48
|
SJ 2105-1982
|
|
SJ 21052-2016
|
(General specification for bump flip welding machine)
|
SJ 21052-2016
|
|
SJ 21053-2016
|
(General specification for selective spray coater)
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SJ 21053-2016
|
|
SJ 21054-2016
|
(General specification for parallel seam welder)
|
SJ 21054-2016
|
|
SJ 21057-2016
|
(A Method for Measuring Temperature Properties of Permanent Magnet Materials and Permanent Magnets)
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SJ 21057-2016
|
|
SJ 21058-2016
|
(WXF0812-P41 Power Amplifier Chip Specification)
|
SJ 21058-2016
|
|
SJ 21059-2016
|
(Specification for WXF0812-P19 Driver Amplifier Chip)
|
SJ 21059-2016
|
|
SJ 21060-2016
|
(Specification for WXY0812-06 Type CNC Phase Shifter Chip)
|
SJ 21060-2016
|
|
SJ 21061/1-2016
|
(Specification for Ceramic Connectors for RP28D Refrigeration Type Infrared Focal Plane Detectors)
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SJ 21061/1-2016
|
|
SJ 21061/2-2016
|
(Specification for Ceramic Connectors for RP44 Type Refrigeration Type Infrared Focal Plane Detectors)
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SJ 21061/2-2016
|
|
SJ 21061-2016
|
(General specification for ceramic connectors for refrigerated infrared focal plane detectors)
|
SJ 21061-2016
|
|
SJ 2106-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS49
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SJ 2106-1982
|
|
SJ 21062-2016
|
(Semiconductor chip product handling, packaging and storage operation requirements)
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SJ 21062-2016
|
|
SJ 21063-2016
|
(Technical requirements for wire forming process of microwave components)
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SJ 21063-2016
|
|
SJ 21064-2016
|
(Technical Requirements for Snacking Process of Components for Microwave Components)
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SJ 21064-2016
|
|
SJ 21065-2016
|
(Technical requirements for reflow soldering of microwave components)
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SJ 21065-2016
|
|
SJ 21066-2016
|
(Technical requirements for manual welding of microwave components)
|
SJ 21066-2016
|
|
SJ 21067-2016
|
(Technical Requirements for Welding of Microwave Components)
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SJ 21067-2016
|
|
SJ 21068-2016
|
(Technical requirements for cementing and potting of microwave components)
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SJ 21068-2016
|
|
SJ 21069-2016
|
(Microwave component coating process technical requirements)
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SJ 21069-2016
|
|
SJ 21070-2016
|
(Microwave assembly technology requirements)
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SJ 21070-2016
|
|
SJ 21071-2016
|
(Technical Requirements for Microwave Component Debugging Technology)
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SJ 21071-2016
|
|
SJ 2107-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS50
|
SJ 2107-1982
|
|
SJ 21072-2016
|
(Microwave component identification process technical requirements)
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SJ 21072-2016
|
|
SJ 21073-2016
|
(Microwave component redundancy prevention and control requirements)
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SJ 21073-2016
|
|
SJ 21074-2016
|
(Technical requirements for reworking of microwave components)
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SJ 21074-2016
|
|
SJ 21075-2016
|
(Microwave component inspection requirements)
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SJ 21075-2016
|
|
SJ 21076-2016
|
(Microwave frequency source test method)
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SJ 21076-2016
|
|
SJ 21077-2016
|
(Microwave module thermal vacuum test method)
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SJ 21077-2016
|
|
SJ 21079-2016
|
(Standard for performance of metal - based printed boards)
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SJ 21079-2016
|
|
SJ 21081-2016
|
(Rigid printed board identification test graphics)
|
SJ 21081-2016
|
|
SJ 2108-1982
|
Detail specification for N channel junction field-effect low power switching transistors, Type CS51
|
SJ 2108-1982
|
|
SJ 21082-2016
|
(Printed packaging and storage)
|
SJ 21082-2016
|
|
SJ 21083-2016
|
(Design of high density interconnection printed boards)
|
SJ 21083-2016
|
|
SJ 21084-2016
|
(Standard Specification for Rigid Copper Clad Laminate for Printed Circuit)
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SJ 21084-2016
|
|
SJ 21086-2016
|
(Specification for solder resist for printed circuit boards)
|
SJ 21086-2016
|
|
SJ 21091-2016
|
(Printed board appearance and size inspection method)
|
SJ 21091-2016
|
|
SJ 2109-1982
|
Pulsed magnetrons, Type CKM-29B, CKM-29D, CKM-29E, CKM-29F, CKM-29G
|
SJ 2109-1982
|
|
SJ 21092-2016
|
(Standard Test Method for Electrical Performance of Printed Boards)
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SJ 21092-2016
|
|
SJ 21093-2016
|
(Standard Test Method for Physical Properties of Printed Boards)
|
SJ 21093-2016
|
|
SJ 21094-2016
|
(Standard Test Method for Chemical Properties of Printed Boards)
|
SJ 21094-2016
|
|
SJ 21095-2016
|
(Standard Test Method for Mechanical Properties of Printed Boards)
|
SJ 21095-2016
|