YS/T 1024-2015_English: PDF (YS/T1024-2015)
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| YS/T 1024-2015 | 209 |
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Tantalum sputtering targets
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| Standard ID | YS/T 1024-2015 (YS/T1024-2015) | | Description (Translated English) | Tantalum sputtering targets | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H63 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 9,987 | | Date of Issue | 2015-04-30 | | Date of Implementation | 2015-10-01 | | Quoted Standard | GB/T 1804; GB/T 4340.1; GB/T 6394; GB/T 8651; GB/T 15076.8; GB/T 15076.13; GB/T 15076.14; GB/T 15076.15; GB/T 20967-2007; YS/T 837; YS/T 899 | | Regulation (derived from) | Ministry of Industry and Information Technology Announcement (2015 No. 28) | | Issuing agency(ies) | Ministry of Industry and Information Technology of the People's Republic of China | | Summary | This Standard specifies for the preparation of thin films of tantalum sputtering target material requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificate and purchase order (or contract) content. This Standard applies to vacuum electron beam melting high purity tantalum ingots as raw materials produced by plastic working, heat treatment, machining, welding methods such as tantalum sputtering target (hereinafter referred to as the tantalum target). |
YS/T 1024-2015
(Tantalum sputtering target)
ICS 77.150.99
H63
People's Republic of China Nonferrous Metals Industry Standard
Tantalum sputtering target
Issued on. 2015-04-30
2015-10-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points.
This standard was drafted. Ningxia Orient Tantalum Industry Co., Ltd., there is research billion of new materials Co., Ltd., Ningbo Jiang Feng Electronic Materials shares
Ltd., Xi'an Branch Fang New Material Technology Co., Ltd.
The main drafters of this standard. Zhong Jingming, Li Guipeng, Wang Kai, Lizhao Bo, Yao Lijun, Xiong, Wang Li, places Corning, Wang Xiaoqing, Du railways.
Tantalum sputtering target
1 Scope
This standard specifies for the preparation of thin films of tantalum sputtering target material requirements, test methods, inspection rules and signs, packaging, transportation, storage,
Quality certificate and purchase order (or contract) content.
This standard applies to vacuum electron beam melting high purity tantalum ingots as raw material by plastic working, heat treatment, machining, welding, etc.
Producing a sputtering target of tantalum (Ta target hereinafter).
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 1804 General tolerances Tolerances for linear and angular dimensions without individual tolerance
GB/T 4340.1 metallic materials - Vickers hardness test - Part 1. Test methods
GB/T 6394 Determination of average grain size of metal
GB/T 8651 sheet metal plate wave ultrasonic flaw detection method
Determination of GB/T 15076.8 Methods for chemical analysis of tantalum and niobium carbon and sulfur content
Determination of GB/T 15076.13 chemical analysis of tantalum and niobium tantalum nitrogen content
Determination of GB/T 15076.14 chemical analysis of tantalum and niobium for oxygen
Determination of GB/T 15076.15 chemical analysis of tantalum and niobium amount of hydrogen
GB/T 20967-2007 destructive testing visual inspection General
YS/T 837 sputtering targets - back binding quality ultrasonic inspection
Determination glow YS/T 899 high purity tantalum chemical analysis of trace elements in the discharge mass spectrometry
3 Requirements
3.1 Categories
Purity tantalum target divided by. 3N5 (99.95%), 4N (99.99%), 4N5 (99.995%) at three levels.
3.2 Chemical composition
Chemical composition of the tantalum target material should meet the requirements of Table 1.
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