GB/T 42839-2023 English PDF

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GB/T 42839-2023: Semiconductor integrated circuits - Analog digital (AD) converter
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 42839-2023	569	Add to Cart	5 days	Semiconductor integrated circuits - Analog digital (AD) converter	Valid

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Basic data

Standard ID: GB/T 42839-2023 (GB/T42839-2023)
Description (Translated English): Semiconductor integrated circuits - Analog digital (AD) converter
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L56
Classification of International Standard: 31.200
Word Count Estimation: 30,379
Date of Issue: 2023-08-06
Date of Implementation: 2023-12-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 42839-2023: Semiconductor integrated circuits - Analog digital (AD) converter

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200 CCSL56 National Standards of People's Republic of China Semiconductor integrated circuit Analog to digital (AD) converter Published on 2023-08-06 Implemented on 2023-12-01 State Administration for Market Regulation Released by the National Standardization Administration Committee

Table of contents

PrefaceⅠ 1 Scope 1 2 Normative reference documents 1 3 Terms and Definitions 2 4 Category 2 4.1 Overview 2 4.2 Double integral type 2 4.3 ∑-Δ modulation type 2 4.4 Successive approximation type 2 4.5 Fully parallel type 2 4.6 Pipeline type 2 5 Technical requirements 2 5.1 Temperature 2 5.2 Electrical Characteristics 3 5.3 Packaging characteristics 4 5.4 Other indicators 4 6 Electrical Characteristics Test Method 4 6.1 General instructions 4 6.2 Static characteristics 4 6.3 Dynamic characteristics 14 7 Inspection Rules 22 7.1 General requirements 22 7.2 Inspection classification 22 7.3 Quality Assessment Category 22 7.4 Sampling plan 22 7.5 Inspection lot composition 23 7.6 Appraisal and inspection 23 7.7 Quality consistency inspection 23 7.8 Filter 26 8 flag 26 9 Packaging, transportation and storage27 9.1 Packaging 27 9.2 Transport 27 9.3 Storage 27

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This document was drafted by. China Electronics Technology Standardization Institute, Hangzhou University of Electronic Science and Technology, Chengdu Huawei Electronics Co., Ltd., Chengdu Huawei Electronics Co., Ltd. Duzhenxin Technology Co., Ltd., China Electronics Technology Group Corporation 58th Research Institute, China Electronics Technology Group Corporation 24th Research Institute Institute, Sichuan Yisheng Xinke Information Technology Co., Ltd., Beijing Xinkejian Technology Co., Ltd., Institute of Semiconductors, Chinese Academy of Sciences, Guangdong Weizhaoye Optoelectronic Energy Saving Co., Ltd., Huiyang East Asia Electronic Products Co., Ltd., Hangzhou Wan Hi-Tech Co., Ltd. The main drafters of this document. Li Kun, Xing Hao, Zhang Chi, Li Dagang, Wang Huiying, Zhang Tao, Lei Langcheng, Xie Hongjian, Zhong Mingchen, Li Wenchang, Dong Hongliang, Wang Yongjun, Lin Ling, Sui Chunjuan. Semiconductor integrated circuit Analog to digital (AD) converter

1 Scope

This document specifies the classification, technical requirements, inspection methods, and Inspection rules, marking, packaging, transportation and storage. This document applies to AD converters designed and manufactured using semiconductor integrated circuit technology.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 4589.1-2006 Semiconductor devices Part 10.General specifications for discrete devices and integrated circuits GB/T 4937.3-2012 Mechanical and climatic test methods for semiconductor devices Part 3.External visual inspection GB/T 4937.4-2012 Mechanical and climatic test methods for semiconductor devices Part 4.Strongly accelerated steady-state damp heat test (HAST) GB/T 4937.11-2018 Mechanical and climatic test methods for semiconductor devices Part 11.Rapid temperature change double liquid bath method GB/T 4937.13-2018 Mechanical and climatic test methods for semiconductor devices Part 13.Salt spray GB/T 4937.14-2018 Mechanical and climatic test methods for semiconductor devices Part 14.Terminal strength (lead robustness) GB/T 4937.15-2018 Mechanical and climatic test methods for semiconductor devices Part 15.Soldering heat resistance of through-hole mounted devices GB/T 4937.21-2018 Mechanical and climatic test methods for semiconductor devices Part 21.Solderability GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23.High temperature operating life GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26.Electrostatic discharge (ESD) sensitivity test Human Body Model (HBM) GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27.Electrostatic discharge (ESD) sensitivity test Machine Model(MM) GB/T 9178 Integrated circuit terminology GB/T 12750-2006 Semiconductor device integrated circuits Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits) GB/T 17574-1998 Semiconductor devices integrated circuits Part 2.Digital integrated circuits SJ/T 10147 Integrated circuit anti-static packaging tube SJ/T 11587 Technical requirements for anti-static packaging of electronic products IEC 60749-9.2017 Mechanical and climatic test methods for semiconductor devices Part 9.Marking durability (Semiconductorde- IEC 60749-24.2004 Mechanical and climatic test methods for semiconductor devices Part 24.Steady-state damp heat (Semiconductor ......

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